Evaluation board complements FTDI’s USB power delivery ICs
The FT4233HP high speed USB serial/FIFO evaluation board will enable engineers to get started much quicker on implementing USB power delivery arrangements, says FTDI. It can be used, for example, for retrofitting functionality into legacy designs, or in new items of equipment during prototyping.
The board measures 138.5 x 77mm, with a pair of Type-C power delivery ports incorporated in it. The first of these ports is capable of covering both sink (receiving power) and source (providing power) roles. The second port serves only as a sink. Both ports are able to support the 5.0, 9.0, 12, 15 and 20V power delivery object profiles (as defined in revision 3.0 of the USB power delivery specification). Profiles may be configured via attachment of an external EEPROM, with LED indicators signifying which power delivery object profile is in use.
While the first port offers USB data transmission plus power delivery, the second port only has power delivery capabilities. A power pass-through function has also been included, with the input power on the second port being passed to the first port. External control of power delivery policy can be achieved using the on-board I2C interface and the GPIO pins. These allow adjustment of the voltage regulator and the load switch.
The FT4233HP evaluation board will be available in Q4 2021.
FTDI Chip develops silicon to ‘bridge technologies’ in order to support engineers with feature-rich, robust and simple-to-use product platforms. The platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate. FTDI Chip’s long-established, continuously expanding USB product line boasts such universally recognised product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series.
FTDI Chip is a fabless semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).
