Industrial maker board increases Aaeon’s UP family
To expand vertical markets and accelerate AIoT deployments, the UP Squared 6000 is an industrial computing maker board from Aaeon. It has a small form factor of just 101.6 x 101.6mm. The board is powered by Intel Atom x6000E / RE, Pentium or Celeron N / J series SoC (formerly Elkhart Lake). It is designed for vertical markets, such as robotics, smart agriculture, retail, and vision-intensive applications, and delivers up to 1.7x single-thread performance, 1.5x multi-thread performance and 2x graphical processing performance enabled by Intel UHD Graphics (11th Generation GPU).
To meet the design requirement of AI deployments, the UP Squared 6000 has multiple M.2 sockets for Intel Myriad X module, NVMe storage, 5G connectivity and Wi-Fi5 / 6 modules. It also has 40-pin general purpose I/O (HAT-compatible) and 100-pin board-to-board connector (available in Intel Atom x6000E / RE models only) for I/O expansions through a carrier board. With the carrier board, UP Squared 6000 will drive an Intel Programmable Service Engine by offering CAN bus, QEP, additional dual GbE Ethernet ports and RS-232 for industrial applications. The carrier board, scheduled for launch in Q2, will be available with Intel Atom x6425RE and Intel Atom x6413E processors.
Integrating the carrier board will also mean the UP Squared 6000 can drive the Intel Programmable Service Engine (PSE) offering out-of-band (OOB) management. This allows IT personnel to remotely manage manufacturing assets even when the operating system is unresponsive or the device is powered off.
Supplied in purpose-built housing, the UP Squared 6000 can be expanded as UP Squared 6000 Edge featuring all the I/O connectivity of the mainboard and IoT enhancements including time sensitive networking (TSN), time-co-ordinated computing (TCC), in-band ECC and onboard TPM 2.0.
Integrating the UP Squared 6000 mainboard and the additional carrier board, allows the board to be used as a UP Squared 6000 Edge computing kit to unlock the Intel PSE and accelerate computer vision and deep learning applications with its preloaded Intel Distribution of OpenVINO toolkit.
Trial versions of the carrier board and Intel PSE and the UP Squared 6000 Edge computing kit will be launched in Q1, ahead of the carrier board which will be available by Q2.
