Silicone gap filler absorbs electromagnetic waves
A thermal interface material (TIM) which absorbs electromagnetic energy has been developed by Fujipoly. Sarcon EGR30A is described as having a tacky, gel-like consistency which makes makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source, such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks.
Sarcon EGR30A also provides absorption effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 3.0W/m degree K (ASTM D 2326) and a thermal resistance of 1.65K cm2/W at 14.5 PSI.
Fujipoly offers the TIM in a choice of five sheet thicknesses (0.5, 1.0, 1.5, 2.0 and 2.5mm) up to a maximum dimension of 300 x 200mm. Sarcon EGR30A can also be ordered in die-cut form to fit almost any application shape.
The latest TIM in Fujipoly’s portfolio is suitable for environments with operating temperatures that range from -40 to +120 degrees C and exhibits a UL94 flame retardant rating of V-0.
Fujipoly America is a wholly owned subsidiary of Fuji Polymer Industries of Japan. An IATF 16949:2016 certified and ISO9001:2015 registered company, Fujipoly America specialises in the fabrication of silicone rubber technology, in particular Zebra elastomeric connectors, Sarcon thermal interface materials, fusible tapes, and custom silicone rubber extrusions.
Fuji Polymer Industries has divisions located in North America, Europe and Asia and an international network of distributors and representatives. The company’s North American operations are based in Carteret, New Jersey.
