Toshiba unveils 1200V SiC MOSFETs designed for stability
Five 1200V silicon carbide (SiC) MOSFETs released by Toshiba leverage the company’s third generation SiC technology, claimed to boost the energy efficiency of high voltage industrial applications. The TW015N120C, TW030N120C, TW045N120C, TW060N120C, and TW140N120C are designed for use in equipment such as electric vehicle (EV) charging stations, photovoltaic (PV) inverters, industrial power supplies, uninterruptible power supplies (UPS), and bidirectional or half-bridge DC/DC converters.
Toshiba has improved the on-resistance x gate-drain charge (RDS(on) x QGD) figure of merit in the third generation SiC technology by more than 80 per cent to raise conduction and switching performance in power-conversion topologies.
The MOSFETs also contain the second generation’s embedded Schottky barrier diode (SBD) which overcomes internal parasitic effects to maintain a stable device RDS(on).
Maximum gate-source voltage ranges from -10 to 25V, which enhances flexibility to operate in various circuit designs and application conditions. The gate-threshold voltage (VGS(th)) ranges from 3.0 to 5.0V, whichensures predictable switching performance with minimal drift and permits a simple gate driver design, said Toshiba.
The TW015N120C, TW030N120C, TW045N120C, TW060N120C, and TW140N120C SiC MOSFETs have RDS(on) values from 15 to 140 mOhm (typical, at VGS = 18V) and drain current ratings from 20 to 100A (DC at TC=25 degrees C).
All the devices are in full production and ready to order from distributors, in the standard TO-247 power package.
About Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Electronic Devices and Storage. TEE offers European consumers and businesses a variety of innovative hard disk drive (HDD) products plus semiconductors for automotive, industrial, IoT, motion control, telecomms, networking, consumer and white goods applications. The company’s portfolio encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors as well as microcontrollers and application specific standard products (ASSPs).
TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services.
