Fischer Elektronik address heat dissipation with SGK
The increasing integration density of assembled PCBs coupled with rising heat loss of electronic devices place ever greater demands on the cooling concept of cases used in assemblies. Fischer Elektronik said this heat dissipation can be solved by using heat dissipation cases or cooling fin enclosures. It has developed the SGK case series which offers optimised heat dissipation properties with quick and easy assembly of electronic devices.
They consist of a generously dimensioned heatsink. The heatsink’s width and depth can be adapted to the cooling concept of any assembly, noted Fischer Elektronik. There is also an aluminium sheet metal shell and two side panels also made of 1.5mm thick aluminium sheet. A standard mainboard, mounting plate or non-standard PCB is attached via the press-in threaded bushes located in the case shell. Depending on the application and the design of the PCBs, the fastening elements can also be attached to the bottom of the heatsink. Optional mounting brackets provide options for table, wall or ceiling mounting as well as in an environment subject to vibration.
The SGK is available in three sizes and in three surface finishes (transparent passivated, natural-coloured and black anodised) as a standard. Customers can also order a customised design by specifying the case parameters, such as width, height, depth and the distances between the mounting bushes and the height.
The sheet metal shell, the heatsink as well as the side parts can be mechanically processed, surface-treated and printed to customer requirements.
The SGK cases are supplied, with the mounting material, ready for assembly.
Fischer Elektronik has core competencies in cooling products, namely heatsinks, semiconductor cooling devices and thermal interface material. It also offers 19-inch enclosures, connectors, brackets and optoelectronics. Services available include printing, anodising, tin plating, gilding and passivating.
