TouchNetix introduces BGA packaging for aXiom chip
Norwegian chip company, TouchNetix has introduced ball grid array (BGA) packaging for its largest aXiom chip, the AX198A. The reduced footprint of the BGA package allows for smaller PCBs which reduces cost and overall size, added the company.
This package is specially designed for industrial customers and human machine interfaces. The AX198A chip supports screen sizes up to 65 inches and in a wide range of aspect ratios, making it suitable for wide displays. Features include 3D proximity and hover sensing, enabling air gestures. It also has multi-force sensing and low-latency haptic triggering, together with parallel multi-touch and multi-force, enabling safety-enhancing systemic redundancy.
There is also integrated support for passive and active dial-on-display. The sensing system detects and suppresses moisture and water, even when using gloves. The introduction of BGA packaging allows customers to integrate aXiom’s capacitive technology with less space required on the PCB, said Dr Gaute Myklebust, chief technology officer at TouchNetix.
The AX198A with BGA packaging is available now and in stock.
TouchNetix creates safety-enhancing user experiences based on touch technology. Its aXiom product family creates new and innovative features for modern product development. TouchNetix manufactures chips and touch sensor modules for a customer base with offices in Norway, United Kingdom, Germany, USA, Korea, Taiwan and through several distribution partners.
TouchNetix’s aXiom chips are designed for all markets, including Automotive, Industrial, Appliance, Medical and Consumer markets. In addition to traditional multi-touch capabilities, aXiom enables touchless and 3D sensing above the surface, force sensing as well as haptic triggering.
TouchNetix is QMS-certified to ISO 9001 with an IATF-16949 certified supply chain, and aXiom chip products are qualified according to AEC-Q100 and are ASIL B ready certified.
