Rutronik adds Molex’s DuraClik wire-to-board connector system
The DuraClik 2.00mm wire-to-board connector system from Molex has secure mating and low space requirements, making it suitable for use in demanding environments where shock and vibrations are likely to be encountered, such as automotive use. It is suitable for applications up to a tensile force of 100N.
The wire-to-board connector is now available from Rutronik. The secure connection is crucial, because loose links can lead to signal interference, explained the distributor. In addition, the independent secondary lock (ISL) and the terminal position assurance (TPA) versions are suitable for operating temperatures up to 125 degrees C.
Molex’s DuraClik Wire-to-Board connector system is available in 2.0mm pitch for twoto 15 circuits in single row configuration with vertical and right angle orientation. There is also the option to tin- or gold-plate the contacts.
The ISL and TPA versions operate at temperatures up to 125 degrees C, meeting the most stringent requirements for applications in harsh environments. The TPA version also features the Interia Lock system, which provides even better protection against loose connections and ensures a secure connection. The ISL version meets LV214, ES91500-03 and SAE/USCAR-21 specifications.
The DuraClik wire-to-board connector is suitable for automotive, commercial vehicles, and consumer electronics. In automotive designs it can be used in headlights, head-up displays, navigation system and vehicle connectivity. It is also suitable for electromobility, e. g., battery management systems and in consumer electronics, it is suitable for electrical household appliances, LED lighting, vending, and gaming machines
Rutronik Elektronische Bauelemente was founded in 1973 and is still an independent family-owned company based in Ispringen, Germany.
It has more than 80 offices worldwide and logistics centres in Austin (Texas), Shanghai, Singapore, and Hong Kong to provide customer support in Europe, Asia, and North America. The company focuses on high-growth future markets that will shape the world of electronics tomorrow, namely Advanced Materials, Advanced Measurement, Processing & Analytics, Advanced Robotics, Automation, Biotechnology, Energy & Power, Future Mobility, IIoT & Internet of everything, Industry 4.0, Medical & Healthcare, and Transportation, Logistics & Supply Chain.
