PCIM Asia Shanghai Conference 2025 programme to explore power electronics in AI and e-mobility, adds new ‘Power Chiplet’ session
The PCIM Asia Shanghai Conference returns to Shanghai this September. The 2025 programme will unite industry leaders, technical experts and academics to explore advanced solutions and future trends, highlighting developments in cutting-edge technologies such as silicon carbide (SiC), gallium nitride (GaN), motor drives and motion control, and more. Debuting at the conference is the new “Dialogue with Speakers” zone, where dedicated booths will provide a setting for more direct and in-depth interactions between speakers and attendees.
Held in conjunction with the PCIM Asia Shanghai exhibition, the PCIM Asia Shanghai Conference addresses key industry topics including motion control systems and power supply solutions. The exhibition, in turn, showcases the latest technologies in power electronics components, power conversion, intelligent motion and more. The combined programme brings together leading specialists from the power electronics sector, application fields, and research institutions worldwide to share their knowledge and discuss the future of the industry.
The 2025 conference programme will feature 95 presentations on new applications, advanced technologies and recent developments in the field. Structured around three keynotes, the agenda also incorporates a variety of oral presentations, poster and special sessions.
The keynote presentations will cover developments in power electronics, focusing on energy efficiency, power density and reliability across three major application scenarios: data centres, chip power supply and new energy vehicles.
Mr Zhaozheng Hou from Huawei Digital Power will explore the evolution of AI data centre power supply architectures, analysing solutions from high-voltage input to chip-level power delivery chains.
Prof Teng Long from the University of Cambridge will share insights on high-density, high-efficiency power supply technologies for AI computing chips, explaining how advanced power electronics can meet the power demands of high-performance processors.
Mr Chang Liu from Suzhou Inovance Automotive will detail the technological evolution of electric vehicle power electronic converters, covering future developments from system architecture to manufacturing processes.
Special session: “Power Chiplet” Technology, Ultra-high-power Density Platform for Future Power Electronics
This technology spotlight will introduce the concept of the “Power Chiplet”, a new approach for miniaturising components in AI servers and electric vehicle onboard chargers. Organised by Prof Ichiro Omura from Kyushu Institute of Technology and chaired by Mr Naoto Fujishima from Fuji Electric, the programme will bring together leading experts from China, Japan and Europe to discuss methods for maximising power density and system integration using chip-embedded PCB technology. The presentations will explore how this can address challenges related to Moore’s Law, reduce costs and enable heterogeneous integration.
Prof Ichiro Omura will share insights on power chiplet technologies for next-generation power electronic systems.
The conference programme is complemented by a variety of oral presentations and poster exhibits from experts at leading companies and universities, including Fuji Electric, Harbin Institute of Technology, Infineon, Mitsubishi Electric and Tongji University. Drawing from both industrial and academic research, these contributions will address new products and technical applications in areas such as Si devices, e-mobility, power conversion, wide bandgap technologies, packaging, peripheral components and circuitry and smart grids.
New “Dialogue with Speakers” zone to connect innovators with industry leaders
To extend the discussion beyond the formal presentations, the 2025 Conference will introduce a new “Dialogue with Speakers” zone, where dedicated booths will provide a setting for more direct and in-depth interactions between speakers and attendees. Breaking away from the conventional one-way presentation format, these interactive exchanges are designed to facilitate communication across industry, academia, research, and application, enabling attendees to ask further questions, discuss related technical subjects, share their own insights, refine concepts, connect with industry leaders and initiate new business or research collaborations.
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