Infineon expands power path protection portfolio for 48 V and future AI

Infineon has launched its 48 Volt smart eFuse family and a reference board for hot-swap controllers for 400 V and 800 V power architectures in AI data centres. This enables developers to design a reliable, robust and scalable solution to protect and monitor energy flow.

With the expansion of its power protection portfolio Infineon supports the growing requirements for power path protection solutions for current and future high-power AI server ecosystems ranging from 48 V to +/-400 V and 800 V. Smart eFuses as well as the hot-swap controller technology are essential in high-performance computing environments to enable monitoring, reduce disruptions, and maximize server uptime which becomes increasingly important to minimise the total-cost-of-ownership (TCO).

Infineon’s eFuse ICs XDP730, XDP720, and XDP721/22 are a critical component in 48 V power delivery systems of current AI data centres. The eFuses are designed to protect against overcurrent and other power-related faults ensuring a reliable and efficient power flow from grid to core. They integrate a range of products, including a digital protection controller, an OptiMOS FET, a gate driver, and a current sensor. eFuses enable hot-swapping, the ability to connect or disconnect IT and power equipment to the DC bus while the system is still powered on and operating. They react extremely fast to overcurrent or short-circuit events, provide protection for the equipment and real-time telemetry data such as voltage, current, energy, and power as well as faults and anomalies.

In higher voltage systems of 400 V and 800 V hot-swapping becomes more difficult because of its high energy demand. That is why Infineon has launched the REF_XDP701_4800 hot-swap controller reference design optimised for future 400 V / 800 V rack architectures. The reference design is based on its market and application proven XDP hot-swap controller – a key safety component in future AI data centre power delivery systems.

In combination with Infineon’s 1200 V SiC JFET technology the digital hot-swap controller allows to control the device in a linear mode which lets the power system run safely and reliable without being damaged or degraded in case of over voltage events. The simplified design and reduced component count of Infineon’s hot-swap controllers allow for efficient power delivery and reduced downtime in AI data centres. The new Infineon hot-swap controller reference board enables designers to program the optimal trajectory for controlling the inrush current based on the device’s SOA (Safe Operating Area), delivering a nominal Thermal Design Power (TDP) of 12 kW.

www.infineon.com

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