New power modules from Microchip for demanding applications
Microchip has announced its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standards. Available in a wide range of topologies, including half-bridge, full-bridge, three-phase and PIM/CIB configurations, providing designers with the flexibility to optimise for performance, cost and system architecture.
Tested to meet HV-H3TRB standards that exceed the 1,000-hour standard for deployments in industrial and renewable energy applications. With a Comparative Tracking Index (CTI) 600V case, stable Rds(on) across temperature ranges and substrate options in Aluminium Oxide (Al₂O₃) or Aluminium Nitride (AlN), the modules provide insulation, thermal management and long-term durability.
To streamline production and reduce system complexity, BZPACK modules feature a compact, baseplate-less design with Press-Fit, solderless terminals and optional pre-applied Thermal Interface Material (TIM). These versatile options enable faster assembly, improved manufacturing consistency and easier multi-sourcing through industry standard footprints. Additionally, the modules are designed to be pin compatible for ease of use.
Microchip’s MB and MC families of mSiC MOSFETs offer solutions for both industrial and automotive applications, with AEC-Q101 qualified options available. These devices support common gate-source voltages (VGS ≥ 15V) and are offered in industry-standard packages for ease of integration.
The MC family integrates a gate resistor, delivering switching control, maintaining low switching energy and stability in multi-die module configurations. Current options are available in TO-247-4 Notch and die form (waffle pack).
