Now available from Rutronik, Omron’s high-temperature G6K-T1 signal relays
Electronic systems continue to become smaller while delivering ever greater functionality. Additional sensors, IoT connectivity, and increasingly powerful processors are driving higher component density on printed circuit boards. As a result, one challenge is becoming increasingly familiar to hardware designers: PCB temperatures continue to rise while the available space for thermal management keeps shrinking.
Although fans, heat sinks, or larger PCBs can provide additional thermal headroom, they also increase system cost, size, and complexity. As a result, engineers are looking for components that maintain reliable operation under elevated temperatures while providing greater flexibility in system design.
Specifically developed for applications combining high component density with elevated operating temperatures, these signal relays support ambient temperatures of up to 125°C. Compared with conventional signal relays, they provide significantly greater thermal design margin, helping engineers reduce – or even eliminate – the need for additional cooling measures.
Beyond their extended temperature capability, the G6K-T1 relays combine a compact footprint of just 10 × 6.5 × 5.2 mm with switching currents of up to 2 A. This makes them an ideal choice for applications that previously required larger relays or more elaborate thermal management solutions. At the same time, they retain the inherent advantages of electromechanical relays, including galvanic isolation, ultra-low leakage current, and straightforward circuit implementation.
To accommodate different system requirements, the G6K-T1 family is available in single-side stable and single-winding latching versions, as well as in SMT and through-hole packages. -Y variants additionally provide an impulse withstand voltage of up to 2.5 kV between the coil and contacts, offering enhanced robustness in demanding environments.
