Aaeon updates industrial motherboard to double bandwidth and speed
The third generation industrial motherboard of the Up Squared Pro series is the Up Squared Pro 7000 which introduces MIPI CSI camera support, LPDDR5 memory and enhanced CPU performance, all in a 4.0 x 4.0 inch form factor.
According to Aaeon, it is the first industrial motherboard equipped with the Intel Core / Atom / N-series processors (formerly Alder Lake-N), which offers 1.4 times the CPU performance of the previous generation. Another enhancement is support for the Intel Distribution of OpenVino toolkit. The board also hosts 16Gbyte of onboard LPDDR5 4800MHz system memory, doubling the bandwidth and data transfer speed of the previous model, reported Aaeon, while also increasing overall energy-efficiency.
Support for MIPI CSI (camera serial interface) cameras via an FPC port frees up the two 2.5GbE (Intel i226-IT) and three USB 3.2 Gen 2 ports for other peripheral devices. Developers also gain access to exceptional expansion from the dense, 4.0 x 4.0 inch (101.6 x 101.6mm) board, with the same 40-pin GPIO header alongside M.2 E, M, and B keys for CNVI, PCIe and USB add-ons.
For vision-intensive applications, the board’s improved display interface boasts HDMI 2.0b and DP 1.2 ports, and DP 1.4a via USB Type-C to achieve three simultaneous 4K displays. These are combined with Intel UHD graphics for 12th generation Intel processors for use in smart factory robotics and digital signage systems.
The Up Squared Pro 7000 also features onboard TPM 2.0 and OS support for Windows 10 IoT Enterprise, Windows IoT Core, Ubuntu 22.04 LTS and Yocto 4 in addition to support for the Intel Distribution of OpenVino toolkit.
Established in 1992, Aaeon designs and manufactures industrial IoT and AI edge industrial motherboards and systems, rugged tablets, embedded AI Edge systems, uCPE network appliances, and LoRaWAN/WWAN products. Aaeon provides experience and knowledge to provide OEM/ODM services worldwide. The company works closely with cities and governments to develop and deploy smart city ecosystems and works closely with premier chip designers to deliver stable, reliable platforms. It is also recognised as a Titanium member of the Intel Internet of Things Solutions Alliance.
