Automotive grade dual inline SiC power modules target onboard chargers
Dual-inline SiC power modules developed by STMicroelectronics offer versatile package configurations for automotive applications, said the company. The AcePack DMT-32 family of SiC power modules are in a convenient 32-pin, dual-inline, moulded, through-hole package for automotive applications.
Target applications are automotive systems such as on-board chargers (OBC) as well as DC/DC converters, fluid pumps and air conditioning. According to STMicroelectronics, the power modules offer high power density in a very compact design and simplified assembly. The product family enhances flexibility for system designers by presenting a choice of four-pack, six-pack and totem-pole configurations.
The modules contain 1200V SiC power switches that leverage ST’s second- and third-generation SiC MOSFET technology ensuring low RDS(on) values. They also deliver efficient switching performance with minimal dependence on temperature to ensure high efficiency and reliability at converter system level.
Leveraging ST’s robust AcePack technology, the modules reduce overall system- and design development costs while ensuring reliability. The package technology features a high-performance aluminium nitride (AlN) insulated substrate for thermal performance. There is also an integrated NTC sensor that provides temperature monitoring for thermal protection.
The first product in the AcePack DMT-32 to be introduced with ramp-up to volume production is the M1F45M12W2-1LA. The M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA are sampling now with ramp-up to volume production starting from Q1’24.
