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Renesas acquires Pictorus to simplify and accelerate embedded application software development

Thu, 18 June
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Cadence accelerates digital twin–driven data centre AI modernisation with HPE

Wed, 17 June
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Murata collaborates with Synopsys to provide Simulation Models

Tue, 16 June
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Registration now open for Microchip’s European MASTERs conference

Tue, 16 June
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ST expands ST87M01 NB-IoT module platform with certifications for North America and Brazil

Thu, 11 June
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IAV and Nexperia rethink high-voltage architectures to unlock more value from every battery cell

Thu, 11 June
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Omron to demonstrate power-control for safe, efficient electrification at smarter E Europe 2026

Wed, 10 June
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Nexperia and Semikron Danfoss explore strategic collaboration on SiC power modules

Tue, 09 June
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Infineon and Vingroup’s VinRobotics form partnership to shape the future of humanoid robots

Tue, 09 June
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Infineon and Siemens leverage silicon carbide technology to advance electrical protection in data centres and factories

Mon, 08 June
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Murata and Xona Space Systems sign MOU to leverage LEO satellite navigation capabilities for industrial applications

Wed, 03 June
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Avnet Silica to showcase practical power innovation at PCIM 2026

Tue, 02 June
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Nutanix unified storage achieves NVIDIA certification as enterprises race to build AI factories

Mon, 01 June
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Rohm PLECS simulator now available for rapid power electronics circuit verification

Fri, 29 May
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Infineon presents semiconductor solutions for power infrastructure, AI data centers, robotics and electromobility at PCIM Europe 2026

Tue, 26 May
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Arrow and Ignite Next announce strategic collaboration to scale deep tech innovation

Thu, 21 May
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ADI to acquire Empower Semiconductor, expanding its next-gen power portfolio for the AI era

Wed, 20 May
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Farnell’s “Top Tech Voices” podcasts explore curiosity, AI and the future of human-centred cities in latest episodes

Wed, 20 May
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Infineon launches EU flagship project Moore4Power to drive the next generation of sustainable power electronics

Wed, 20 May
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ams OSRAM sells CMOS Image Sensor business to indie Semiconductor, concentrating its growth investments into AI Photonics and AR smart glasses

Tue, 12 May
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4 days ago

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Panasonic launches a next‑generation transparent conductive film Panasonic announces the release of FineX (“FineCross”), a next‑generation transparent conductive film engineered for high‑performance electromagnetic wave shielding in advanced or sensitive display, industrial, and wireless communication environments. FineX combines high optical transmissivity, ultra‑low electrical resistance, and design flexibility.Built on Panasonic’s #softei #technews #electronicsnews ... See MoreSee Less

Panasonic launches a next‑generation transparent conductive film - Softei.com - Global Electronics Industry News

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Panasonic launches a next‑generation transparent conductive film - Latest News
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5 days ago

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TI unveils power architecture for future AI data centres with NVIDIA TI has unveiled a complete 800V direct current (DC) power architecture for next-generation AI data centres built with the NVIDIA 800 VDC reference design. The solution will be showcased at NVIDIA GTC, March 16-19, 2026, at NVIDIA's power architecture display and TI's booth 169, demonstrating how TI's analog and embedded processing technology supports NVIDIA's vision for advancing high-voltage #electronicsnews #softei #technews ... See MoreSee Less

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6 days ago

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u-blox expands automotive GNSS portfolio enabling ADAS at a global scale u-blox has announced the expansion of its automotive GNSS portfolio with the launch of two highly specialised modules: the ZED-X20K and the ZED-A20K. Both modules feature pin-to-pin compatibility, enabling platform flexibility and simplifying product development across vehicle generations as well as jamming and spoofing detection to mitigate the impact of security risks.As automakers #electronicsnews #technews #softei ... See MoreSee Less

u-blox expands automotive GNSS portfolio enabling ADAS at a global scale - Softei.com - Global Electronics Industry News

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u-blox expands automotive GNSS portfolio enabling ADAS at a global scale - Latest News
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7 days ago

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Discover Melexis’ power electronics solutions in action at PCIM 2026 Melexis will showcase its latest sensing and protection technologies for ePowertrain and power electronics at PCIM 2026.At PCIM 2026, Melexis’ team will showcase how its IC portfolio helps engineers increase system performance and solve key design challenges across high-power automotive and industrial applications. Melexis will highlight key ePowertrain trends and the role of sensing #softei #electronicsnews #technews ... See MoreSee Less

Discover Melexis’ power electronics solutions in action at PCIM 2026 - Softei.com - Global Electronics Industry News

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Discover Melexis’ power electronics solutions in action at PCIM 2026 - Industry News
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1 week ago

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NXP’s new i.MX 93W fuses edge compute and secure wireless connectivity NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 #electronicsnews #softei #technews ... See MoreSee Less

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1 week ago

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Kontron launches VX30101 High End 3U VPX Board Kontron has announced the upcoming Kontron VX30101. This new-generation 3U VPX High-End Computing Board is designed for AI-enabled mission computing, sensor fusion, rugged embedded servers and tactical edge applications.The ruggedised SWaP-C optimised VX30101 delivers high-performance heterogeneous computing, integrated AI acceleration and ultra-fast networking capabilities. It is among the first 3U VPX boards #electronicsnews #technews #softei ... See MoreSee Less

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1 week ago

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Designing for AI at the Edge in 2026 Artificial intelligence investment over the past two years has been concentrated in hyperscale infrastructure. While advanced accelerators, high-bandwidth memory, and leading-edge process nodes continue to absorb significant capital expenditure, Avnet Silica’s Q1 2026 Trendliner report notes that inference capability is increasingly being implemented beyond the cloud. Inference workloads are being deployed across a wider #electronicsnews #softei #technews ... See MoreSee Less

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Designing for AI at the Edge in 2026 - Technical Articles/White Papers
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2 weeks ago

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ST announces new sensors for personal electronics and smart devices ST has introduced a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB colour) sensors, part of the ST BrightSense portfolio, are now available to early adopters, enabling customers to start designing their next generation of smart, #electronicsnews #technews #softei ... See MoreSee Less

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2 weeks ago

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Kontron announces compact SoM with TI processor Kontron is expanding its product portfolio with the OSM-S AM62L, a compact system-on-module (SoM) compliant with the OSM standard. The module features an energy-efficient dual-core Arm Cortex-A53 processor from Texas Instruments with 1.25 GHz and offers an optimal balance of performance and power consumption.Designed for space-saving embedded platforms, the OSM-S AM62L is suited for a variety of applications #electronicsnews #softei #technews ... See MoreSee Less

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2 weeks ago

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High-speed data acquisition from Teledyne for advanced applications The ADQ35 is engineered for use in areas such as swept source optical coherence tomography (SS OCT), time of flight mass spectrometry, distributed fibre-optic sensing, LiDAR, scientific instrumentation, and automated test equipment. These applications require digitisers capable of capturing and processing large volumes of data with high fidelity and minimal latency. To meet these requirements, #electronicsnews #softei #technews ... See MoreSee Less

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IDS launches Nion 3D ToF camera for industrial use with 1.2 MP depth sensing https://softei.com/ids-launches-nion-3d-tof-camera-for-industrial-use-with-1-2-mp-depth-sensing/?utm_source=ReviveOldPost&utm_medium=social&utm_campaign=ReviveOldPost #softei #electronicsnews #technews

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Rutronik advances GaN-based power electronics with new RAK-GaN #electronicsnews #softei #technews

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Murata type 2FR Tri-Radio module now available from Rutronik https://softei.com/murata-type-2fr-tri-radio-module-now-available-from-rutronik/?utm_source=ReviveOldPost&utm_medium=social&utm_campaign=ReviveOldPost #technews #softei #electronicsnews

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New packaged MOSFET from Diodes delivers efficiency in automotive systems #electronicsnews #softei #technews

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