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Toshiba launches 650V 3rd generation SiC MOSFETs in compact TOLL package

Tue, 02 September
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Infineon expands OptiMOS 6 portfolio with 150 V MOSFETs in TOLL, TOLG, and TOLT packages

Mon, 01 September
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ROHM releases a new compact PFC + flyback control reference design for power

Thu, 21 August
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New Renesas USB-C power solution improves performance

Wed, 20 August
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Battery management technology from TI delivers up to 30% longer run time

Tue, 29 July
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Gate driver photocouplers from Toshiba enhance MOSFETs and IGBTs switching efficiency

Tue, 29 July
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Infineon’s CoolSiC MOSFET package enable higher power density for industrial applications

Tue, 29 July
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Next-generation package for power MOSFETs from Toshiba

Tue, 22 July
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ROHM develops an ultra-compact MOSFET ideal for fast charging

Tue, 08 July
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NXP’s new battery cell control IC family for new energy solutions

Wed, 02 July
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Renesas announces new GaN FETs for high-density power conversion

Wed, 02 July
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ROHM Introduces a new MOSFET for AI Servers

Tue, 01 July
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TDK introduces 20 and 40A, 80Vdc board-mount EMI Filters

Tue, 01 July
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LEM launches a new series of DC energy meters for fast and megawatt EV chargers.

Tue, 01 July
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Microchip expands its space portfolio with 15W DC-DC power converter

Thu, 26 June
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1.3kW fully digital, configurable, modular AC-DC power supply series from XP

Thu, 26 June
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TDK expands programmable power supply series with 3U high 6kVA and 9kVA models

Tue, 24 June
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ST reveals advanced 1600V IGBTs for cost-sensitive, energy-conscious appliance markets

Mon, 16 June
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LEM releases a first of its kind high-voltage battery sensor

Tue, 10 June
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Ultra-compact SiC MOSFETs from Toshiba enhance power density and efficiency

Tue, 20 May
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1 week ago

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With new standards for AI inference, Axelera Metis AI accelerators now at Rutronik Rutronik has recently added Axelera AI, a European pioneer in AI and edge computing, to its franchise partners. Axelera Metis products offer an alternative to traditional GPU-based solutions. The Metis AI platform is a holistic AI solution that combines state-of-the-art hardware and software. The hardware portfolio includes the Metis M.2 AI Inference Acceleration Card and the #technews #softei #electronicsnews ... See MoreSee Less

With new standards for AI inference, Axelera Metis AI accelerators now at Rutronik - Softei.com - Global Electronics Industry News

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With new standards for AI inference, Axelera Metis AI accelerators now at Rutronik - Latest News
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1 week ago

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Cliff Electronics enhances North American presence through DigiKey distribution partnership Cliff Electronics has strengthened its global distribution network through a strategic partnership with DigiKey.This collaboration opens new doors for Cliff in the North American market while providing DigiKey customers with immediate access to UK-manufactured components with same-day shipping options.This partnership enables quicker development cycles and easier #softei #electronicsnews #technews ... See MoreSee Less

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Cliff Electronics enhances North American presence through DigiKey distribution partnership - Industry News
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1 week ago

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Bourns announces new micro encoders offering high reliability in a compact design Bourns has announced its PEC04 Series 4 mm Incremental Micro Encoder, its PEC05 Series 5 mm Incremental Micro Encoder and its Model PEC06, a 6 mm Incremental Micro Encoder. Bourns new micro encoders provide position and speed information essential for control functions in a broad variety of electronic applications.The Bourns PEC04 Series is designed for use in today’s more #softei #technews #electronicsnews ... See MoreSee Less

Bourns announces new micro encoders offering high reliability in a compact design - Softei.com - Global Electronics Industry News

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Bourns announces new micro encoders offering high reliability in a compact design - Latest News
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2 weeks ago

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Innodisk introduces memory modules for rugged industrial applications Innodisk has released its new DDR5 CAMM2 and LPDDR5X CAMM2 (LPCAMM2) memory modules. With 60% less space and blazing speeds up to 6400 MT/s and 8533 MT/s, respectively, Innodisk’s CAMM2 series marks a strategic leap into the rugged device and compact system market.Innodisk’s new CAMM2 series features a distinctive design. DDR5 CAMM2 and LPDDR5X CAMM2 consolidate dual channels on a #technews #electronicsnews #softei ... See MoreSee Less

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Innodisk introduces memory modules for rugged industrial applications - Latest News
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2 weeks ago

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PCIM Asia Shanghai Conference 2025 programme to explore power electronics in AI and e-mobility, adds new ‘Power Chiplet’ session The PCIM Asia Shanghai Conference returns to Shanghai this September. The 2025 programme will unite industry leaders, technical experts and academics to explore advanced solutions and future trends, highlighting developments in cutting-edge technologies such as silicon carbide (SiC), gallium nitride (GaN), motor drives and motion #electronicsnews #technews #softei ... See MoreSee Less

PCIM Asia Shanghai Conference 2025 programme to explore power electronics in AI and e-mobility, adds new 'Power Chiplet' session - Softei.com - Global Electronics Industry News

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PCIM Asia Shanghai Conference 2025 programme to explore power electronics in AI and e-mobility, adds new 'Power Chiplet' session - Industry News Highlights
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2 weeks ago

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Kontron announces a robust IPC for demanding AI and vision applications Kontron has introduced the new KBox B-301-RPL, a robust high-end IPC based on a µATX motherboard designed and manufactured in Germany with 14th Gen Intel Core processors. The powerful IPC can be supplemented with fast NVIDIA GPUs, making it perfect as a central control unit for highly complex applications. These include applications with high demands on 3D graphics or vision and AI #technews #softei #electronicsnews ... See MoreSee Less

Kontron announces a robust IPC for demanding AI and vision applications - Softei.com - Global Electronics Industry News

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Kontron announces a robust IPC for demanding AI and vision applications - Latest News
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2 weeks ago

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ST to strengthen position in sensors with acquisition of NXP’s MEMS sensors business ST has entered into agreement for the acquisition of NXP’s MEMS sensor business for a purchase price of up to US$950 million in cash, including US$900 million upfront and US$50 million subject to the achievement of technical milestonesThe MEMS businesses of ST and NXP are strongly complementary in terms of technology and product portfolio, with the combined product #technews #softei #electronicsnews ... See MoreSee Less

ST to strengthen position in sensors with acquisition of NXP’s MEMS sensors business - Softei.com - Global Electronics Industry News

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ST to strengthen position in sensors with acquisition of NXP’s MEMS sensors business - Industry News Highlights
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3 weeks ago

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Rutronik supports industry in implementing complex EU requirements The European Union is setting new standards for cybersecurity with the Cyber Resilience Act (CRA), which presents electronics manufacturers, importers, and distributors with significant challenges. Small and medium-sized enterprises, in particular, are confronted with complex requirements, short deadlines, and significant liability risks. Rutronik is addressing this development together with its #technews #softei #electronicsnews ... See MoreSee Less

Rutronik supports industry in implementing complex EU requirements - Softei.com - Global Electronics Industry News

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Rutronik supports industry in implementing complex EU requirements - Industry News
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3 weeks ago

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µCooling Fan-on-a-Chip solution for XR smart glasses delivers in-frame active thermal management xMEMS Labs has announced the expansion of its revolutionary µCooling fan-on-a-chip platform into XR smart glasses, providing the industry’s first in-frame active cooling solution for AI-powered wearable displays.As smart glasses rapidly evolve to integrate AI processors, advanced cameras, sensors, and high-resolution AR displays, thermal management has #technews #electronicsnews #softei ... See MoreSee Less

µCooling Fan-on-a-Chip solution for XR smart glasses delivers in-frame active thermal management - Softei.com - Global Electronics Industry News

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µCooling Fan-on-a-Chip solution for XR smart glasses delivers in-frame active thermal management - Wearable
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3 weeks ago

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binder addresses miniaturization in power supply systems As modern machinery continues to shrink in size, the demand grows for powerful yet compact connectors. binder meets this need with its M12 Power connectors, which transmit high voltages reliably in space-critical environments. Due to changing application requirements, these connectors are increasingly replacing traditional 7/8" connectors. However, the latter continue to play a crucial role—especially #technews #softei #electronicsnews ... See MoreSee Less

binder addresses miniaturization in power supply systems - Softei.com - Global Electronics Industry News

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binder addresses miniaturization in power supply systems - Latest News
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Call for papers for the embedded world Conference and electronic displays Conference 2026 #softei #technews #electronicsnews

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New Renesas USB-C power solution improves performance https://softei.com/new-renesas-usb-c-power-solution-improves-performance/?utm_source=ReviveOldPost&utm_medium=social&utm_campaign=ReviveOldPost #softei #electronicsnews #technews

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ams OSRAM doubles UV-C LED efficiency https://softei.com/ams-osram-doubles-uv-c-led-efficiency/?utm_source=ReviveOldPost&utm_medium=social&utm_campaign=ReviveOldPost #softei #technews #electronicsnews

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Toshiba introduces lens reduction type CCD linear image sensor for A3 multifunction printers #technews #electronicsnews #softei

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