congatec adds COM-HPC Client CoMs with 13th Gen Intel Core models
The latest COM-HPC Client Computer-on-Modules (CoMs) available from congatec are based on variants of 13th Gen Intel Core processors. They expand the company’s portfolio of COM-HPC modules with soldered processors to include more powerful socketed variants of the latest processor generation. The company has introduced conga-HPC / cRLS CoMs in COM-HPC Size C form factor (120 x 160mm).
They address application areas that require multi-core and multi-thread performance, large caches together with “enormous memory capacities”, high bandwidth and advanced I/O technology, said congatec.
Target markets are industrial, medical and edge applications using AI and machine learning (ML), as well as embedded and edge computing with workload consolidation requirements for which congatec also supports real-time hypervisor technologies from Real-Time Systems.
“With currently up to eight Performance cores in parallel to 16 Efficient cores, the socketed variants of the 13th Gen Intel Core processors empower our COM‑HPC modules to offer even more options for making edge computing more performant and efficient through workload consolidation,” explained Jürgen Jungbauer, senior product line manager at congatec. IoT-connected systems are expected to process many tasks in parallel; the more cores a CoM provides, the better, said congatec.
The socketed 13th Gen Intel Core processors deliver up to 34 per cent gain for multi-thread and up to four per cent single-thread performance gain, reported congatec. There is also 25 per cent faster image classification inference performance, compared to 12th Gen Intel Core processors. The added DDR5-5600 support and increased L2 and L3 cache on selected models enhance multi-threaded performance further.
There is also enhanced USB3.2 Gen 2×2 bandwidth of up to 20 Gbit per second on the new COM-HPC Size C CoMs.
congatec is focused on embedded and edge computing products and services. The company’s high performance computer modules are used in a range of applications and devices in industrial automation, medical technology, transportation, and telecommunications.