Fischer Elektronik introduces U-shaped retaining springs for transistor designs
The company’s extensive product range of transistor retaining springs has been extended with new U-shaped spring geometries. Fischer Elektronik has introduced six retaining spring models. All are made of a corrosion-protected spring steel.
Effective thermal management is essential to ensure the durability, reliability and performance of electronic devices and similarly, the mechanical attachment of the devices on the heat dissipation component to achieve the lowest heat transfer resistance between the contact pair plays a significant role in the design, reasoned Fischer Elektronik.
For many applications, the way in which semiconductors are fixed is considered by customers to be a cost-reducing factor, continued the company. Being able to fix the components quickly and easily without neglecting the aspects of mechanical safety and thermal contacting is also important. In addition to the classical device mounting using various screw or adhesive connections, transistor retaining springs from Fischer Elektronik provide a very good possibility of fixing transistors on, or to, a heatsink.
The THFA 5 to THFA 10 are adapted in their contour and dimensions to the different types of transistors, such as TO 218, TO 220, TO 247 and TO 3P. The spring geometry consists of a straight surface which acts as a transistor support surface, whereas an opposite rounding exerts the contact pressure on the component by means of spring action and locks it securely and reliably.
Depending on the design, the individual transistor retaining springs contain a locking point for the respective transistor or a special latching geometry, with which the spring can be fixed directly on the PCB in a groove. It is also possible to mount transistors on an external fin of a heatsink. In many extruded heatsinks as comb profiles, the external cooling fins are thicker in terms of material thickness, so that transistors can be placed on the fin contour from the outside and fixed securely and quickly by pushing over the THFA retaining springs. At the base of the heatsink, the external cooling fins, in conjunction with the U-shaped transistor retaining springs, provide an additional component mounting surface.
