Fischer Elektronik shrinks cooling aggregates
Fischer Elektronik has introduced miniature cooling aggregates for its LAM 6 series of cooling aggregates. Cooling aggregates, such as fan-assisted designs, increase efficiency, said the company, but effectiveness for forced convection is only maximised if the geometry and surface of the heat exchange areas are matched to the fan used and its performance in terms of air volume and pressure.
To meet this challenge, Fischer Elektronik is expanding its existing product range of miniature cooling aggregates with the LAM 6 D and LAM 6 D K designs. They have small dimensions of just 60 x 120mm and are available for transistor screw mounting or clip mounting.
The profile cross sections consist of an extrusion profile formed as a tube with cooling fins on the inside of each side surface. The fins absorb the heat emitted by the device and dissipate it to the inner air of the enclosed channel structure. The powerful axial fans circulate air through the fin channel and ensure very efficient device cooling, said the company. The LAM 6 D and LAM 6 D K miniature cooling aggregates are optionally available with fan voltages of 12V, 24V and 48V.
The miniature cooling aggregate LAM 6 D K contains a special groove geometry in the lateral semiconductor mounting surfaces, which is designed to ensure the component can be fastened securely and quickly with the help of snap-in transistor retaining springs. The THFU snap-in transistor retaining springs have been developed for the transistor types TO 218, TO 220, TO 247, TO 264 and various SIP-MultiWatt devices as well as holeless power transistors.
Once installed, the snap-in transistor retaining spring remains in position and fixes the transistor on the mounting surface using high contact pressure. Mechanical CNC machining, modifications or special designs and surfaces can be realised according to customer specifications.
