Harwin will showcase support tools, latest connector technology and EMC protection at electronica 2024
At electronica 2024 visitors to the Harwin booth (A2.335) will experience first-hand the latest digital tools for rapid product selection and application development and see the company’s latest board-to-board and high-reliability connectors and board-level shielding products.
During the event in Munich from 12th to 15th November Harwin specialists will demonstrate a range of online services that speed and simplify design. These include powerful tools such as an interactive cable configurator offering real-time 3D rendering from Cadenas (a leading software developer in the areas of strategic parts management and parts reduction) and the SnapMagic (formerly SnapEDA) search engine solution.
“Our aim is to bring a B2C experience to a B2B market by making selecting and deploying our high-performance and reliable technologies as fast and as intuitive as possible,” says Peter Schneid, Harwin’s VP of Marketing. “This means giving our customers access to best-in-class tools and services via our website and third-party platforms. During electronica we will give visitors the opportunity to see for themselves how our investment in these tools and services greatly simplifies the selection and development process, helping design engineers to speed time-to-market.”
Among the Harwin connector technologies on show for the first time will be additions to the Gecko range of high-performance, high-reliability micro-miniature signal connectors and the popular Kona family of high-current interconnects. The company will also exhibit Flecto floating, board-to-board data and power connectors that provide the positional tolerance needed to support high-speed automated assembly of PCBs with multiple connector pairs.
Visitors seeking EMC solutions will find the latest EZi board-level shielding and accessories encompassing EMI/RFI shielding cans, simple-to-adapt shielding kits, contacts, sockets, cable clips and jumper links.
