Infineon expands CoolGaN portfolio launching CoolGaN Drive HB 600 V G5 family
Infineon expands its CoolGaN portfolio with the CoolGaN Drive HB 600 V G5 product family. The four new devices – IGI60L1111B1M, IGI60L1414B1M, IGI60L2727B1M, and IGI60L5050B1M – integrate two 600 V GaN switches in a half-bridge configuration together with integrated high- and low-side gate drivers and a bootstrap diode, delivering a compact, thermally optimised power stage that further reduces design complexity. By bringing key functions into one optimised package, the family lowers external component count, eases PCB layout challenges typically associated with fast-switching GaN and helps designers shorten development cycles while achieving the core advantages of GaN technology: higher switching frequencies, lower switching and conduction losses, and greater power density.
Targeting low-power motor drive systems and switched-mode power supplies, the integrated half-bridge enables smaller magnetics and passive components, higher efficiency across operating conditions, and improved dynamic performance in space-constrained designs. Engineered for high-speed precision, the device achieves ultra-fast switching with a 98 ns propagation delay and minimal mismatch, supporting efficient high-frequency operation while maintaining predictable timing behaviour. For simplified system integration, it offers a PWM input compatible with standard logic levels and operates from a single 12 V gate driver supply, while fast UVLO recovery helps ensure robust behaviour during start-up and transient supply events. For superior thermal performance, the products are housed in a 6 x 8 mm² TFLGA-27 package with exposed pads, enabling efficient heat spreading and supporting heatsink-less designs in many applications.
