Infineon introduces its next generation of dual-channel isolated gate driver ICs
Infineon Technologies has introduced the next generation of the EiceDRIVER product family of dual-channel galvanically isolated gate driver ICs.
This product family spans multiple under-voltage lockout (UVLO) variants, isolation levels and package options. The new portfolio combines robust isolation technology that meets the latest isolation standards with electrical parameters to deliver high efficiency and reliable operation over a wide temperature range, extending the design’s lifetime, claimed the company.
These drivers can be used in a wide range of applications, including server and telecom SMPS, solar inverters and energy storage systems, motor drives and battery-powered applications, electric vehicle (EV) charging and high-performance computing.
Compared to its predecessor, the new EiceDRIVER generation includes DSO 14-pin packages for extended channel-to-channel creepage and features dead-time and shoot-through protection, as well as a faster UVLO start-up time. It is equipped with robust isolation technology that meets the latest isolation standards (VDE 0884-11, IEC 60747-17).
In addition, it comes in highly compact LGA 4 x 4mm2 packages that allow for a space-saving of up to 36 per cent in low-voltage applications. The company claimed one of the most important improvements is the galvanic isolation integrated into the gate driver ICs, which is now certified according to IEC 60747-17. This certification ensures that these products are prepared for 20 years of operation and meet the highest safety standards.
The shortened UVLO start-up time (2 micros instead of 5 micros) enables a faster SMPS start-up and eliminates the risk of mains power-transformer saturation. In addition, the new ICs include an output clamping circuit that implements an active output clamping approach to quickly clamp the output noise even if the channel is inactive. According to the company, this is the most versatile approach to prevent dangerous half-bridge shoot-through events during boot-strapped start-up while the gate driver supply is still below the UVLO on threshold.
The new gate driver ICs feature configurable shoot-through protection (STP) and dead-time control (DTC) built into their hardware. The packaging design includes the removal of unused pins, formerly declared to be ‘no connects’. This feature enables higher channel-to-channel isolation ratings and provides higher PCB layout flexibility, making it easier for designers to develop their circuits.
The dual-channel galvanically isolated gate driver ICs are available in leaded DSO and leadless LGA packages. DSO variants are offered in 14- and 16-pin configurations, both with 150mm (narrow body) and 300mm (wide body) form-factor. The LGA variants are offered in 5 x 5mm2 and 4 x 4mm2 dimensions.
