Infineon launches high-density TLVR power modules optimised for AI data centres
As a result of the rapid growth of cloud-based services, particularly those enabling artificial intelligence (AI), data centres are now responsible for more than two percent of global energy consumption. This figure is expected to rise further, with exponential growth of 165 percent predicted between 2023 and 2030. Continuously improving efficiency, power density, and signal integrity of power conversion from the grid to the core is therefore critical to advancing computing performance while reducing total cost of ownership (TCO). To address this need, Infineon is launching the OptiMOS TDM22545T dual-phase power module, the industry’s first trans-inductance voltage regulator (TLVR) module specifically designed for high-performance AI data centres.
The module’s proprietary TLVR inductance architecture minimises the number of output capacitors, reducing the overall size of the voltage regulator (VR) and significantly lowering material costs (bill of material; BOM).
The OptiMOS TDM22545T module combines robust trench technology power stages with proprietary TLVR inductors. This results in excellent power density, improved electrical and thermal efficiency, and enhanced signal quality with reduced transients. The inductor design delivers an ultra-fast transient response to dynamic load changes caused by AI workloads without compromising electrical and thermal efficiency. This directly translates into increased computing throughput, a robust system design, and reduced TCO for AI data centres. The new module is also compatible with vertical power delivery (VPD) systems, where power delivery network (PDN) losses can be reduced up to 50% versus traditional top-side lateral designs. It supports up to 140 A across both phases in a compact form factor of 9 x 10 x 5 mm³.
