Infineon launches TLVR quad‑phase module for next‑generation AI compute
Infineon has unveiled a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) inductors to meet the power demand of advanced AI data centres. The TDM24745T is a new OptiMOS quad‑phase power module designed to meet the rapidly growing power requirements of next‑generation AI accelerators. Integrating four power stages, a TLVR inductor and decoupling capacitors into a compact 9 x 10 x 5 mm³ package. The module delivers industry‑leading current density exceeding 2 A/mm². This combination enables exceptional transient performance and supports the high‑current core rails required by advanced GPU and AI processors, in lateral as well as vertical power delivery configurations.
As the power requirements of AI data centres continue to rise, power architectures must become more compact, responsive and efficient. The TDM24745T addresses these challenges by simplifying power architecture design, enabling higher power density to free up PCB space for additional compute resources, and delivering an extremely fast transient response. The TLVR architecture can also reduce the required output capacitance by up to 50 percent, helping system designers achieve space‑saving layouts that directly contribute to energy savings and improved TCO across AI server platforms.
As the industry’s first TLVR quad‑phase module in this compact form factor, the TDM24745T offers up to 320 A peak current capability, making it especially well-suited for next‑generation AI processors and high‑current multiprocessor platforms. Combined with Infineon’s digital multiphase controllers, the module supports flexible and scalable architectures that accelerate system deployment in fast‑evolving AI environments. Powered by OptiMOS‑6 MOSFET technology, chip‑embedded integration and proprietary magnetics, it delivers improved efficiency and thermal performance even in the densest AI server designs, contributing to the development of more energy efficient AI factories.
The TDM24745T power module integrates seamlessly into Infineon’s end‑to‑end AI server power delivery ecosystem, which spans everything from the grid interface to the core processor rails.
