MOSFETs with top-side cooling assist in automotive design says onsemi
A series of MOSFET devices that feature top-side cooling have been introduced by onsemi to assist designers in motor control and DC/DC conversion automotive design.
The single N-channel power Top Cool MOSFETs are housed in a TCPAK57 package measuring just 5.0 x 7.0mm. They have a 16.5mm2 thermal pad on the top side which allows heat to be dissipated directly into a heatsink rather than via a typical PCB. By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density, explained onsemi. Improved reliability extends the lifetime of the system, added the company.
The MOSFETs can simplify design and reduce size and cost, said onsemi. The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1mOhm. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high speed switching applications.
onsemi claimed that its expertise in packaging provides the highest power density in the industry. The TCPAK57 initial portfolio includes 40, 60 and 80V. All devices are capable of operating at junction temperatures (Tj) of 175 degrees C and are AEC-Q101 qualified and PPAP capable.
The design includes gull wings that allow inspection of solder joints and enhance board level reliability, making them suitable for demanding automotive applications, including target applications such as high / medium power motor controls such as electric power steering and oil pumps.
Samples of the Top Cool MOSFETs are available now with full-scale manufacture planned in January 2023.
Onsemi has a focus on automotive and industrial end markets, and said it is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation and 5G and cloud infrastructure.
