N-channel power MOSFETs exploit heat dissipation to support next-gen vehicles
Two automotive-grade 40V N-channel power MOSFETs have been released by Toshiba for next-generation vehicle designs. The XPQR3004PB and XPQ1R004PB use the large transistor outline gull-wing leads package format or L-TOGLTM to improve heat dissipation.
The MOSFETs are optimised for handling large currents, said Toshiba. They each feature high drain current ratings (400A for the XPQR3004PB and 200A for the XPQ1R004PB) and have on-resistance values of 0.3 mOhm (XPQR3004PB) and 1.0 mOhm (XPQ1R004PB).
The package does not have an internal post structure or solder connection. Instead the source and outer leads are connected with a copper clip. A multi-pin structure for the source leads reduces the package resistance (and associated losses) by about 70 per cent compared with the existing TO-220SM(W) package, reported Toshiba.
The resulting drain current (ID) rating of the XPQR3004PB, represents a 60 per cent increase over the existing TKR74F04PB, housed in the TO-220SM(W) package. Toshiba also claims that the thick copper frame reduces junction-to-case thermal impedance substantially. It is 0.2 degrees C per Watt for the XPQR3004PB and 0.65 degrees C per Watt for the XPQ1R004PB. This eases heat dissipation, lowers operating temperatures and enhances reliability.
The XPQR3004PB and XPQ1R004PB are both AEC-Q101-qualified and intended for use in automotive applications at temperatures up to 175 degrees C. The gull-wing leads reduce mounting stress and allow easy visual inspection to improve the solder joint reliability.
When used in high-current automotive applications, such as semiconductor relays or integrated starter generators (ISGs), the XPQR3004PB and XPQ1R004PB package can enhance heat dissipation but also contribute to size, weight and cost reductions through a lower component count.
Toshiba is shipping the N-channel MOSFETs in volume now.
Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Electronic Devices and Storage. TEE offers European consumers and businesses a wide variety of innovative hard disk drive (HDD) products plus semiconductor solutions for automotive, industrial, IoT, motion control, telecomms, networking, consumer and white goods applications. The company’s broad portfolio encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors as well as microcontrollers and application specific standard products (ASSPs).
TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services.
