New BoVersa enclosure from Bopla for wireless, embedded and instrumentation systems
The BoVersa enclosure from BOPLA offers customers an innovative modern design suitable for a wide range of applications. Flexible and customer-specific design options include a lighting concept, wireless communication and maximised cooling technology.
The new enclosure can be used for applications which require hand-held, tabletop, wall or pole mounting. The enclosure offers optimal conditions for instrumentation, security systems, IoT, wireless, embedded systems and more.
For wireless systems a die-cast aluminium enclosure body with moulded-in cooling fins can be combined with a plastic cover, allowing unhindered radio transmission while providing an optimal combination for wireless applications that require cooling.
For efficient heat dissipation, BoVersa has integrated cooling fins into the die-cast aluminium enclosure. The point-symmetrical design of the fins optimises airflow and ensures cooling of the enclosure when mounted horizontally or vertically. The uniform airflow maximises the efficiency of cooling and provides even and stable temperature distribution in the enclosure, increasing the service life and reliability of the built-in electronics.
BoVersa has a three-part enclosure structure consisting of a lower part, a functional lid and design cover which can be combined with each other as required. Colour accents can be added by combining enclosure parts in different colours to suit an application or branding requirement.
