Physical optimisation engine improves PPA, says Cadence
Enhancements to the digital full flow optimise power, performance and area (PPA) results across a variety of application areas, says Cadence Design Systems.
The new release has been proven with hundreds of completed advanced-node tapeouts optimises PPA across a variety of application areas including automotive, mobile, networking, high-performance computing and artificial intelligence (AI). The flow features what is believed to be the industry’s first unified placement and physical optimisation engines with machine learning (ML) capabilities. This enables design excellence with up to three times faster throughput and up to 20 per cent improved PPA, says Cadence.
The iSpatial technology integrates the Innovus Implementation System’s GigaPlace placement engine and the GigaOpt Optimiser into the Genus synthesis. This enhancement provides techniques such as layer assignment, useful clock skew and via pillars. The technology allows a seamless transition from Genus physical synthesis to Innovus implementation using a common user interface and database.
The addition of ML capabilities enables users to leverage existing designs to train the iSpatial optimisation technology to minimise design margins versus traditional place and route flows.
Another enhancement is the incorporation of unified implementation, timing- and IR-signoff engines, offering enhanced signoff convergence by concurrently closing the design for all physical, timing and reliability targets. This allows customers to reduce design margins and iterations, explains Cadence.
The Cadence digital full flow consists of the Innovus implementation system, Genus synthesis, Tempus timing signoff and Voltus IC power integrity. It provides a fast path to design closure and better predictability, says Cadence, and supports the company’s Intelligent System Design strategy, which enables advanced-node SoC design excellence.
Cadence builds on over 30 years of computational software expertise for electronic design. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Its customers product electronic products from chips to boards to systems for dynamic market applications including consumer, hyperscale computing, 5G communications, automotive, aerospace, industrial and health.
