Samtec launches 800-position AcceleRate HP high-performance array connectors
Samtec has announced the expansion of its AcceleRate HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5mm stack height.
Engineered for next-generation demands, the new AcceleRate HP connectors deliver exceptional signal integrity and density, supporting data rates up to 112 Gbps PAM4 on a 0.635mm pitch. These connectors are optimised for high-throughput applications such as High-Performance Computing (HPC), Artificial Intelligence (AI), storage, and networking.
Key features include:
Protocol compatibility with PCIe 6.0, CXL 3.2, and 100 GbE
800-position configuration (8 rows × 100 positions) in a dense footprint of 68.62mm × 18.20mm (2.701” × 0.717”)
5mm mated stack height, with a 10mm version planned for Q2 2026
5 Ohm impedance
2 A max current rating (one pin powered per row), and 150 VAC (212 VDC) max voltage rating
The APM6 and APF6 connectors utilise Samtec’s Solder Column Termination, enhancing structural integrity. This IPC Class 3 compliant method is ideal for dense, high-speed interconnects and offers superior solder joint reliability and excellent insertion loss and return loss performance.
“These new 800-position connectors represent a significant advancement in high-density, high-speed interconnect technology,” said Eric Mings, Samtec’s High-Speed Board-to-Board Product Manager. “They’re designed to meet the rigorous demands of today’s data-intensive systems while maintaining reliability.”
