Samtec low-profile cable assemblies capable of residing under IC cooling hardware
Samtec has announced production quantity availability of Si-Fly LP low-profile cable assemblies. The extremely low 4.35 mm mated height of Si-Fly LP cable-to-board assemblies allow side-to-side, front-to-back or belly-to-belly PCB mounting near the IC package, with secure placement under heat sinks or other cooling hardware where z-axis height is limited.
Each Si-Fly LP cable assembly provides 112 Gbps PAM4 channel rate in a 2-row, 16-pair design with aggregate data rates of 896 Gbps (x8 bi-directional) or 1.79 Tbps (x16 uni-directional) and is PCIe 6.0/CXL 3.2 capable. Routing signals from the chip through high-density, high-performance Flyover cable reduces thermal challenges, simplifies board layout and improves overall cost by eliminating expensive re-timers and allowing for fewer board layers and less expensive printed circuit board materials.
Si-Fly LP cable assemblies feature Samtec’s proprietary 34 AWG, 92 Ohm ultra-low-skew Eye Speed twinax cable. Eye Speed twinax enables superior signal integrity performance using advanced co-extrusion techniques that optimise symmetry between signal conductors and shielding, achieving extremely low intrapair skew. Signal reach and integrity become increasingly important in high-speed Data Centre, HPC and AI applications where Si-Fly LP is commonly deployed. Each design is unique, so Samtec works with system architects early in the process to create solutions for cable management and thermal load distribution.
