SPI NOR flash is pin-compatible to grow server storage capacity
Industry pin-to-pin compatibility in Winbond’s W25Q512NW SPI NOR flash enables customers to grow code storage Flash capacity from 16Mbits up to 2Gbits without having to change footprint across different hardware platforms.
The single die monolithic 1.8V 512Mb SPI NOR flash can support up to 166MHz standard/dual/quad SPI clocks. It joins the existing 3.0V 512Mbit W25Q512JV. The pin-to-pin compatibility of the 1.8V W25Q512NW SPI NOR flash enables customers to upgrade to higher flash storage and extend the life of their products, speed time to market, and save development time and effort.
Emerging 5G applications require both high-quality and high-density SPI NOR flash said Winbond. The W25Q512NW SPI NOR flash delivers on all these requirements, while also ensuring the reliable supply capacity that is backwards and forwards compatible to the lowest to the highest flash densities available, it added.
The W25Q512NW can support up to 166MHz SDR and 80MHz DDR in high read-speed. It can achieve high performance on eXecute In Place (XIP) and instant-on with QPI. It can also be stacked to 1.0 and 2.0Gbit, which gives designers more flexibility to extend the density up to 2.0Gbit and better performance on read-while-write. For example, the two-die device will support read-while-write operation for over the air (OTA) updates without suspension of read operations. Additionally, there is no risk of losing the existing firmware image in the event of an unexpected power interruption, providing fast and stable live OTA system firmware update.
Designers of 5G modem, 5G edge computing, cloud server, fibre optic modems, and smart IoT segments can typically increase code-storage flash density by a factor of two, every two years, advises Winbond. OEM software teams can use the SPI NOR flash to develop application code for new code releases without compromising on code storage flash memory density limitations.
Winbond Electronics supplies semiconductor memories, and supports customer-driven memory with product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of specialty DRAM, mobile DRAM, code storage flash, and TrustME secure flash, used by tier-1 customers in communications, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. It has
Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
