Surface mount power dividers have “excellent broadband response”

For space, defence and communications markets, Smiths Interconnect offers surface mount resistive and Wilkinson power dividers. They offer excellent broadband response for splitting or combining, said the company.

The series of high frequency, surface mount resistive and Wilkinson dividers operate in the DC 50GHz frequency range. The resistive power dividers offer broadband performance to meet a range of requirements up to 50GHz in a compact footprint. 

The Wilkinson power dividers are offered as off-the- shelf options for a  wide range of requirements up to 40GHz, said Smiths Interconnect. They are designed for demanding applications where performance and isolation is required in more targeted frequency bands. 

This series of chip resistive and Wilkinson dividers complement the company’s surface mount high frequency board level components and expand its space, defence and communication systems portfolio, said Smith’s Tullio Panarello, vice president and general manager of the fibre optics and RF components business unit.

Smiths Interconnect’s high frequency surface mount power dividers with multiple band options allow RF designers to reach more precise splitting and combining in higher frequency application in a repeatable surface mountable solution, said the company. 

The surface mount resistive power divider series provides for an excellent electrical performance and offers all the flexibility of a discrete component, claimed Smiths. The two-way resistive dividers with equal and unequal power ratios can be expanded into more complex structures such as four-way, six-way and eight-way. 

The design can be customised for a specific size and position of input and the outputs. The total thin film process provides tight features tolerances allowing excellent part repeatability, added Smiths. 

Electrical and thermal performances are tested through simulation analysis and real-life tests to ensure series qualification. 

The Wilkinson power dividers provide better insertion loss performance than resistive power dividers and the thin film process technology provides small size, light weight, and a level of power in a cost-effective, easy-to-implement surface mount solution, explained Smiths. 

They have also undergone electrical and thermal performances testing to ensure series qualification.

http://www.smiths.com

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