TDK introduces MEMS-based sonar on a silicon chip ToF sensors
Enabling ultra-wide field-of-view, the Chirp CH-101 ultrasonic sensor is based on MEMS technology. The ultrasonic time of flight (ToF) sensor provides range-sensing with millimeter-precision at the industry’s lowest power consumption, claims TDK.
The Chirp CH-101 ToF sensor uses a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field of view. By calculating the ToF, the sensor can determine the location of an object relative to a device and trigger a programmed behaviour.
TDK’s MEMS ultrasonic technology leverages a proprietary ToF sensor in a 3.5 x 3.5mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a custom low-power mixed-signal CMOS ASIC. The sensor handles ultrasonic signal-processing functions, enabling range-finding, presence/proximity sensing, object-detection/avoidance, and position-tracking.
CH-101 is the first commercially available MEMS-based ultrasonic ToF sensor intended for consumer electronics, augmented reality/virtual reality (AR/VR), robotics, drones, the internet of things (IoT), automotive, and industrial market segments, says TDK.
In its MEMS ultrasonic product portfolio, TDK also offers the CH-201 ultrasonic ToF sensor for room-scale sensing applications and Chirp SonicTrack, a hardware-software system enabling inside-out six degrees of freedom (6-DoF) controller tracking for AR/VR/MR systems.
TDK’s MEMS ultrasonic ToF sensors provide accurate range measurement regardless of target size or colour. Even optically transparent targets are accurately detected, adds TDK.
They are also immune to ambient noise and have the ability to operate in all lighting conditions — unlike IR sensors, which do not work in direct sunlight, TDK points out.
They ensure eye-safety, unlike laser-based IR ToF sensors – and yet are not perceivable by pets.
The ToF sensors detect objects over a field of view up to 180 degrees.
“The CH-101 sensor is the culmination of years of development based on a breakthrough innovation in piezoelectric-MEMS technology and low-power ASIC design, resulting in high-performance, low-power ultrasonic sensing in a tiny package,” said Michelle Kiang, CEO, Chirp Microsystems, a TDK Group Company.
The CH-101 is in mass production now and Chirp’s CH-201 is currently shipping to select customers. TDK will showcase the Chirp CH-101 and CH-201 products, along with TDK’s comprehensive portfolio of sensors, electronic components and solutions for mobile, wearables, AR/VR, automotive, IoT and industrial applications at the Sensors Expo 2019 in San Jose, California, 25 to 27 June, 2019 at the San Jose McEnery Convention Center, Booth 416.
