Technical white paper strengthens expertise in Bosch SiC technologies
As a long-standing partner of Bosch, Rutronik presents a new technical Bosch white paper on silicon carbide (SiC). It offers in-depth insights into Bosch’s more than 20 years of development work and shows how the next generation of SiC power semiconductors enables higher efficiency, robustness and power density in applications such as traction inverters, on-board chargers and DC/DC converters. The white paper is available here free of charge.
SiC semiconductors are considered a key technology for electric mobility. The new white paper from Bosch describes the advantages and background of this class of materials and introduces dual-channel trench MOSFET technology – a proprietary innovation that enables lower switching and conduction losses and significantly increases the efficiency of modern high-voltage systems. Bosch offers its SiC MOSFETs in a wide range of products – from bare dies and discrete components to power modules in 750 V and 1,200 V variants.
Another focus of the white paper is Bosch’s global manufacturing strategy. This includes highly automated production lines, the ongoing transition from 150 mm to 200 mm wafers, process optimisations, defect analyses, and strategies to ensure supply chain resilience. These factors contribute to the reliable and scalable use of SiC technologies in vehicles with long life cycles.
This white paper builds upon the content presented during the FAE training conducted by Bosch and Rutronik in October 2025. During this training session, Rutronik’s teams received detailed updates on Bosch product areas such as Automotive MEMS, Consumer MEMS, SiC, and Automotive ICs. This underlines the focus on further strengthening Rutronik as a design-in partner and providing targeted support to developers in automotive and industrial applications.
The white paper covers the following topics:
Overview of Bosch’s entire SiC portfolio
Functionality and advantages of dual-channel trench MOSFET technology
Efficiency and robustness advantages for traction inverters, OBCs, DC/DC converters
Manufacturing strategy: 150 mm and 200 mm wafers, process optimizations, defect control
Strategic supply chains and global production sites
Best practices for automotive systems and long-life applications
