Three SoM families by congatec are based on Intel Xeon D processors
In parallel to the launch of Intel’s Xeon D processor family (‘Ice Lake D’), congatec has announced three SoMs standard industrial environments based on the processor for industrial, outdoor and in-vehicle applications.
The COM-HPC Server modules in Size E and Size D and the COM Express Type 7 modules are suitable for real-time micro server workloads in rugged environments and extended temperature ranges. They offer up to 20 cores, RAM to up to 1Tbyte, double throughput per PCIe lanes to Gen 4 speed, as well as up to 100 GbE connectivity and TCC/TSN support.
Target applications range from industrial workload consolidation servers for automation, robotics and medical backend imaging to outdoor servers for utilities and critical infrastructures – such as smart grids for oil, gas and electricity as well as rail and communication networks. They are also suitable for vision enabled applications such as autonomous vehicles and video infrastructures for safety and security.
According to congatec, the three SoMs will “significantly extend the lifecycle of next-gen rugged edge server designs” compared to common servers as long-term availability of up to ten years is planned.
For mission critical designs, they offer powerful hardware security features including Intel Boot Guard, Intel Total Memory Encryption – Multi-Tenant (Intel TME-MT) and Intel Software Guard Extensions (Intel SGX). For AI applications, they offer built-in hardware acceleration including AVX-512 and VNNI. The processor modules integrate the Intel Resource Director Technology (Intel RDT) and support remote hardware management features such as IPMI and redfish.
The modules will be available in a HCC (high core count) and a LCC (low core count) variant.
The conga-HPC/sILH COM-HPC Server Size E modules will be equipped with five different Intel Xeon D-2700 processors with a choice of four to 20 cores, eight DIMM sockets for up to 1Tbyte of 2,933Mtransfers per second fast DDR4 memory with ECC, 32x PCIe Gen 4 and 16x PCIe Gen 3 as well as 100 GbE throughput plus real-time capable 2.5Gbit/s Ethernet with TSN and TCC support at a processor base power of 65 to 118W.
The COM-HPC Server Size D and COM Express Type 7 modules will have five different Intel Xeon D-1700 processors with a choice of four to 10 cores. While the conga-B7Xl COM Express Server-on-Module supports up to 128Gbyte DDR4 2,666Mtransfers per second RAM via up to three SODIMM sockets, the conga-HPC/sILL COM-HPC Server Size D module offers four DIMM sockets for up to 256Gbyte of 2,933Mtransfers per second fast DDR4 RAM. Both module families offer 16x PCIe Gen 4 and 16x PCIe Gen 3 lanes. For fast networking, they provide up to 100 GbE throughput and TSN TCC support via 2.5Gbit per second Ethernet at a processor base power of 40 to 67W.
The Intel Xeon D-2700 processor based conga-HPC/sILH COM-HPC Server Size E modules measure 200 x 160mm, the conga-HPC/sILL COM-HPC Server Size D modules measure 160 x 160mm and conga-B7Xl COM Express Type 7 modules measure 95 x 120mm.
The COM-HPC and COM Express Server-on-Modules are application-ready and available with cooling ranging from powerful active cooling with heat pipe adapter to fully passive cooling for best mechanical resilience against vibration and shocks.
Modules have comprehensive board support packages for Windows, Linux and VxWorks. For workload consolidation, real-time virtual machine support is available via congatec’s comprehensive support of RTS Hypervisor implementations from Real-Time Systems.
http://www.congatec.com
