TI unveils high-performance isolated power modules to advance power density
Texas Instruments has unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centres to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI’s IsoShield technology, a proprietary multi-chip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs.
“Packaging innovation is revolutionising the power industry, with power modules at the forefront of this transformation,” said Kannan Soundarapandian, vice president and general manager, High Voltage Products at TI. “TI’s new IsoShield technology delivers what power engineers need most: smaller solutions with improved efficiency and reliability and a faster time to market. It is the latest example of TI’s continued commitment to advance power semiconductor technology to help solve today’s engineering challenges.”
Historically, power designers have turned to power modules to conserve valuable board space and simplify the design process. As chip sizes reach their physical limits and miniaturisation increases in importance, advancements in packaging technology are enabling further performance and efficiency gains.
TI’s new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data centre applications that require reinforced isolation.
Power density innovations are nowhere more critical than in today’s evolving data centre and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centres continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI’s IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world’s digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance.
