Tria provides performance boost for Qseven COM standard
Tria Technologies has launched two new Qseven (Q7) Computer-on-Modules (COMs), ensuring Q7 designs remain viable until at least 2034, with an optional extension to 2039. The new modules, TRIA-Q7-ASL and TRIA-Q7-ALN, are based on the popular Q7 entry-level standard, and provide both a substantial performance boost and a guaranteed product lifetime extension, making Q7 a reliable choice for long-term projects.
Featuring Intel’s innovative “Amston Lake” and “Alder Lake N” platforms, the new TRIA Q7 modules are engineered to keep Q7-based designs feasible, ensuring component continuity well into the next decade.
The TRIA Q7-ASL module integrates the Intel Atom x7000RE/C Series processors, delivering robust and efficient performance. Complementing this, the TRIA Q7-ALN module supports Intel Atom x7000E, Intel Core i3, and N Series, catering to diverse application requirements. Both modules offer up to eight cores and Intel UHD graphics based on Xe architecture for broad application compatibility.
Each new module can support three independent 4K displays for advanced visual solutions and offer high-speed LPDDR5 memory support up to 32GB. There is an extensive set of interfaces including USB 3.1, PCIe Gen3 and eMMC 5.1 on a power saving and cost-efficient Q7 2.1 form factor module. Additionally, the TRIA Q7-ALN and TRIA Q7-ASL modules offer Gigabit Ethernet based on Intel® i226 and support up to 2.5GbE bandwidth.
Available with dual-, quad- and eight-core SoC options, the new Q7 modules are ideal for a wide variety of applications including point-of-sales terminals, digital signage controllers and HMI solutions found in medical equipment, transportation systems, IoT and industrial automation. Furthermore, the Q7-ASL module is ideal for system products that are exposed to more harsh ambient conditions as it is designed for extended temperature range from -40°C to + 85°C, and for 24/7 continuous operation.
Additionally, Tria provides a Q7 2.1 development platform for easy evaluation and design-in of both modules. A complete, ready-to-run Starterkit is available making it as simple as possible for designers to integrate the modules into their systems.
All modules can be used as a plug-and-play solution, combined with carrier boards, or customised depending on the specifics of the application.
