Wafer inspection platform uses AI for AOI function
At next month’s Semicon Taiwan, Test Research (TRI) will exhibit its TR7950Q SII wafer inspection platform. unveils AI powers AOI inspection
The test and inspection systems provider offers the AI-powered AOI machines for the semiconductor and advanced packaging industry. They can inspect die and wire bonding, wafer surface and bumps, epoxy and foreign material detection. Making its debut at the event as part of the company’s smart factory semiconductor inspection offering, the TR7950Q SII is equipped with a 25Mpixel camera to deliver an optimal 2.5 micron high resolution. It also has an optical module for the inspection of highly reflective surfaces.
The company will also showcase the TR7007Q SII, its 3D SPU with a 3.5 micron, high resolution 25Mpixel camera and TR7700Q SII, its AI-powered 3D AOU with the improved 25Mpixel, 2.5micron configuration. The TR7007Q SII and the TR7700Q SII represent TRI’s latest inspection innovations for the advanced packaging and semiconductor industry, said the company. The line up also includes an X-ray inspection demo station, AI station, AI training tool and AI Verify Host.
Visit TRI at Semicon Taiwan 2023 (6 to 8 September), Taipei Nangang Exhibition Center, stand I2800.
Test Research (TRI) provides cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.
