Winbond RAM and Ambiq SoC reduce power needs for intelligent wearables
Memory supplier, Winbond Electronics has collaborated with Ambiq, to combine the former’s HyperRAM and the latter’s Apollo4 SoC to deliver low power system solutions for IoT endpoints and wearables.
Winbond’s 256Mbx8 HyperRAM hybrid sleep mode (HSM) power consumption is about 50 per cent that of normal standby mode, assisting IoT endpoints and wearable to extend more battery life.
The Apollo4 SoC’s hardware and software is purpose-built to allow battery-powered endpoint devices to achieve a higher level of intelligence without sacrificing battery life. Adding HyperRAM can further enhance its low power advantage and allow for faster delivery of high-resolution graphics to improve the performance, says Winbond.
“As the IoT market rapidly expands with the proliferation of diverse mobile and portable devices, how to deliver the most desirable user experience becomes the holy grail for manufacturers. Built on Ambiq’s patented Subthreshold Power Optimized Technology (SPOT) platform, the Apollo4 delivers higher performance at ultra-low power consumption,” said Dan Cermak, vice president of architecture and product planning at Ambiq. “Leveraging Winbond’s HyperRAM to enable expanded storage to support high-resolution displays and complex AI datasets, we can deliver low-power solutions while maintaining low pin count for smaller form-factor endpoint devices.”
The 256Mb HyperRAM operates at 200MHz / 250MHz and is supplied in a 30-ball wafer level chip scale package (WLCSP), 24BGA and KGD.
Ambiq was founded in 2010 delivering microcontroller and SoCs. Through the advanced Subthreshold Power Optimized Technology (SPOT) platform, Ambiq has helped many leading manufacturers worldwide create products that can operate for days, months, and sometimes years on a lithium battery or a single charge.
Winbond Electronics provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of specialty DRAM, mobile DRAM, code storage flash, and TrustME secure flash, used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany.
