650V super junction power MOSFETs have Kelvin source for efficiency

Five super junction power MOSFETs released by Toshiba Electronics Europe are housed in a surface mount TO-leadless (TOLL) package with a Kelvin source connection to improve efficiency.

The compact, surface mount TOLL package helps reduce the size of equipment, says Toshiba. The TK065U65Z, TK090U65Z, TK110U65Z, TK155U65Z and TK190U65Z MOSFETs measure 9.9 x11.68 x 2.3mm. All five MOSFETs have a 27 per cent smaller footprint than a conventional D2PAK package.

The 650V super junction MOSFETs are based on Infineon’s DTMOS VI series with low on-resistance down to 65mOhm.

Deploying the latest generation of the DTMOS VI series of 650V super junction power MOSFETs with the TOLL package will help engineers reduce the size of their end equipment and improve efficiency, says Infineon.

DTMOS VI targets highest efficiency switching with best in class figure of merit Rds(on) x Qdg. The four-pin package includes the option of a Kelvin source. This capability can reduce the parasitic inductance of the source wire in the package and enhance switching efficiency by suppressing oscillation.

Infineon offers the comparison of the TK090N65Z – a device with equivalent voltage and on-resistance that uses the TO-247 package without a Kelvin connection – with the TK090U65Z and says the latter has a 68 per cent lower turn-on switching loss and that turn off switching loss is reduced by about 56 per cent.

Typical applications include server power supplies in data centres, solar (PV) power conditioners, uninterruptible power systems (UPS) and other industrial applications.

The five 650V super junction MOSFETs are in mass production and is shipping now.


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