8100 wire bonder increases productivity says Palomar Technologies

Based on its proven wire bonder design, the 8100 wire bonder incorporates the latest productivity technology and operator ergonomics, says Palomar Technologies.

The 8100 wire bonder is a fully automated, thermosonic high-speed ball-and-stitch wire bonder capable of ball bumping and customised looping profiles.

It also features the latest technology in motion control, software and user experience, says Rich Hueners, vice president of sales and marketing at Palomar Technologies. “Transferring and maintaining programs across multiple systems is straightforward and requires no extra effort whether the systems are all 8100s or a mix of 8000s and 8100s,” he said.

The Palomar 8100 is suitable for a range of applications. According to the company, it offers optimum performance for applications with tight spaces, fragile surfaces, flip-chip, deep access cavities and provides excellent material flexibility. Typical applications for the Palomar 8100 wire bonder include large complex hybrids, HB/HP LED arrays, optoelectronic packaging, chip-on-board (COB), system in packages (SiPs), specialty lead frames, automotive assemblies, flex circuits, multi-chip modules (MCMs), fine pitch devices and LEDs with running stitch.

In addition to Palomar’s VisionPilot Pattern Referencing software for vision processing, programmers can improve yield and utilisation by using Bond Data Miner. This proprietary software provides traceability of bond parameters and a clear overview of processes and performance.  Additionally, it includes Vision Standardization, Palomar’s new software that calibrates images between different Palomar bonding systems, dramatically eliminating the time and cost associated with maintaining programs across multiple systems and numerous programs on a system over time.

The Palomar 8100 is loaded with a full range of ergonomic features designed to increase operator efficiency and decrease fatigue, including an optimised wire-feed path for faster loading and full view of the wire during operation, all user interaction points are comfortably within operator reach, adjustable, articulating monitors and keyboard to cater to all operators, either sitting or standing, a microscope is available for use while the bonder is in operation, graphical real-time displays of all vital operations and gauges in one location and a rapid, informed response via colour-coded error signals for all situations.

Customers using the Palomar 8000 wire bonder include Tier 1 companies who require high reliability, first-level interconnect in advanced microelectronic packages, he continued. “With new features such as Vision Standardization, customers will find that moving from the 8000 to the 8100 will be a seamless transition,” reassured Hueners.


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