The Micro-Fit 3.0 connectors from Molex – new at Rutronik
Rutronik is now stocking the Micro-Fit 3.0 connector system from Molex. The components are embedded in compact, fully polarised housings with fully insulated contacts. They have a pitch of 3.00 mm and are suitable for cable diameters from 18 mm to 30 mm. Their current carrying capacity is up to 10.5 A. They have been developed for wire-to-wire, board-to-board and wire-to-board configurations for powering applications in all areas, and have a wide range of options, such as contact position assurance (TPA).
This variant has been specially developed for blind mating or applications that are difficult to access, has a moulded self-aligning feature and allows a maximum misalignment of 2.54 mm. The wire-to-wire and wire-to-board connectors are extremely robust and ideal for applications in harsh environments.
These connectors prevent contacts from being crushed during cable connections due to improper assembly. Their TPS with integrated secondary fuse also ensures that the contacts remain in place and do not slip.
The Compliant Pin connector, whose special shape is reminiscent of the eye of a needle, enables a reliable connection. They are suitable for both male and female Micro-Fit crimp contacts, which offers the advantage of not having to purchase additional connectors. It is also possible to make ongoing changes from solder to the more cost-effective press-fit applications.
This connector design requires less mating and unmating force, making the interface particularly ergonomic and user-friendly. The RMF contacts enable switching to higher current levels, even during operation, and offer a higher current carrying capacity of 10 A for existing Micro-Fit components. The factory pre-lubricated version can be mated up to 250 times, making it the optimum choice for applications with many mating cycles. It is also available with conductor cross-sections from 22 to 24 and 26 to 30 AWG.
