Samtec expands offering of slim, high-density AcceleRate HD array connectors
Samtec has announced expanded stack heights and pin counts of its AcceleRate HD product line. The ADM6 and ADF6 slim, high-density 0.635 mm pitch array connectors are now available with 5 mm to 16 mm stack heights and 40 to 400 total positions in support of datacom, HPC server and storage, industrial, and military applications.
In addition to density and mechanical versatility, AcceleRate HD board-to-board connectors offer optimised signal integrity and achieve data rates up to 64 Gbps PAM4 (PCIe® 6.0/CXL® 3.2 capable), enabled by the robust Edge Rate contact system. Edge Rate contacts are designed with a smooth, milled mating surface, which reduces wear and increases durability for high-cycle applications. The narrow edge of the contacts is aligned within the connector body to reduce broadside coupling and crosstalk.
The open pin field design, with contacts in a grid pattern within the connector housing, maximises signal routing and grounding flexibility. Designers can choose the single-ended, differential pair, and power configuration best suited for their application.
The ADM6 and ADF6 connectors make use of Samtec’s IPC Class 3 compliant solder column board termination technique. The solder column board termination method is ideal for dense, high-speed interconnects and offers superior solder joint reliability and excellent insertion loss and return loss performance.
