ACM Research offers edge etch and clean to improve wafer yield.
Wet tools from ACM Research now include the Bevel Etch which uses a wet etch method to remove various types of dielectric, metal and organic material films, as well as particulate contaminants on the wafer edge. This approach minimises the impact of edge contamination for subsequent process steps, and improves chip manufacturing yield.
“During the chip manufacturing process, wafer edge peeling, particles and residue result in wafer edge yield loss, especially for 3D NAND, DRAM and advanced logic processes,” explained David Wang, CEO of ACM Research. The Bevel Etch reduces yield loss at the edge, which is becoming increasingly important to optimise overall process yields, he added.
According to ACM its wet processing delivers “significant performance benefits compared to dry approaches”, and consumes less chemicals. In addition, with ACM’s proprietary technology, it can achieve more accurate and efficient wafer centre alignment, which can enable it to deliver precise bevel etch that will enhance product yields and wafer throughput, said the company.
The Bevel Etch supports a range of device types and process steps for 3D NAND etch, DRAM and advanced logic processes.
Historically, manufacturers have used a dry bevel etch process to address edge film and contamination removal. The wet etch approach avoids the arcing and silicon damage risk from the dry process, while also offering variable wafer bevel etch/cut accuracy of 1.- to 7.0mm, good uniformity of +/-0.1mm, controllable etch selectivity and low chemical consumption, for a lower total cost of ownership.
ACM’s Bevel Etch product first tool for high volume manufacturing is expected to be delivered to a Chinese logic manufacturer in the third quarter of 2021.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company is committed to delivering customised, high-performance, cost-effective process solutions that semiconductor manufacturers can use in manufacturing steps to improve productivity and product yield.
https://www.acmrcsh.com
