Ampmodu addresses automation and control

The Ampmodu connector system from TE Connectivity includes board-to-board, wire-to-board and wire-to-wire connectors. The Ampmodu family will now include a UL and VDE-approved 2.0mm platform, comprising of headers and receptacles that will provide extra design freedom and save more space.

According to TE Connectivity, the large variety of small components make this interconnect system suitable for a range of industrial applications. The new Ampmody 2.0mm headers for board-to-board, wire-to-board signal transfers occupy over a third less space than headers with a 2.54mm centreline, says the company. This allows customers to build more functionality onto the boards. The connectors are also available in breakaway, shrouded and stacking versions.

Headers are available for automated SMT, through-hole-reflow (pin-in-paste) and traditional through-hole mounting onto boards with thicknesses of 1.2, 1.6, and 2.4mm. TE Connectivity’s shrouded headers are designed to be intermateable with other major brands, and include a centre-latching version, allowing them to survive in high vibration environments. TE Connectivity will introduce mating board-mount and wire-applied receptacles in 2019.

The 2.0mm connectors join the family of Ampmodu connectors which includes the 50/50 grid connector that showcases a variety of high-density board-to-board and wire-to-board connectors with a pitch of 1.27 x 1.27mm (0.05 x 0.05-inch), while offering parallel stacking in three different heights or mating capability with latched cable assemblies. Ampmodu Mod IV V connectors include rugged wire-to-board connectors on a modular 2.54 x 2.54mm centre line configuration that mate to Ampmodu breakaway headers (shrouded and unshrouded) with a 0.64mm square post.

There are also Ampmodu MTE connectors with coupling shrouds which permit the ganging of receptacle assemblies for dual-row configurations. Specifiers can choose from IDC and crimp termination types, all with a latching capability that provides positive retention between housings. Finally, the Modu System 50 family is made up of various high-density connectors with ribbon or FFC cable terminations

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