Automotive MOSFETs increase power for powertrain applications
Low RDS (ON), 40V MOSFETs from Nexperia are AEC-Q101-qualified. The BUK7M3R3-40H and BUK9M3R3-40H are designed for space-constricted, increased-power modules in demanding powertrain applications.
The MOSFETs use Nexperia’s Trench 9 technology and are housed in the miniature, LFPAK33 package which has a footprint of only 10.9mm² and have a pitch of just 0.65mm. Trench 9 technology reduces RDS (ON) by 48 per cent compared to previous technology devices, says Nexperia and covers a range of applications from 30 up to 300W. The BUK7M3R3-40H and BUK9M3R3-40H (standard level and logic level) MOSFETs have an RDS(ON) of just 3.3 mOhm.
Improved RDS(ON) and current capability allows the LFPAK33 package to replace larger power styles at a lower cost with comparable product performance, says Nexperia. Traditionally DPAK-packaged devices, which are 80 per cent larger than LFPAK33 devices, have been used.
Rugged, Trench 9 Superjunction technology also delivers a higher avalanche capability, explains Nexperia, and greater safe operating area (SOA) for improved performance under fault conditions.
Richard Ogden, Nexperia’s product manager believes: “Automotive design engineers continue to innovate – especially in applications such as water, fuel and oil pumps, and engine filters – focusing on reducing module size but with increasing power requirements. Our Trench 9 automotive LFPAK33 MOSFETs are a good fit for these thermally-demanding powertrain systems, since the unique LFPAK technology absorbs thermal stresses. Other automotive applications include parking brakes, airbag systems, LED Lighting, seat control and heating, window lift and driver infotainment systems.”
Nexperia’s LFPAK33 40 V MOSFET family represents the industry’s largest portfolio of devices in a 3×3 mm footprint, with an additional 16 standard level and logic level devices. Devices are qualified to AEC-Q101 exceeding the requirements of this standard by more than two times.
Nexperia is the former Standard Products division of NXP. The company became independent at the beginning of 2017 and produces over 90 billion semiconductor components annually.