Infineon will supply CoolSiC MOSFETs 1200 V and matching dual-channel EiceDRIVER 2EDB9259Y gate drivers ...
Industry News
New “Connector Clinic” service from Inelco Hunter
Inelco Hunter has launched its Connector Clinic – a free remote diagnosis service designed to ...
Intel Core Ultra Series 3 lays the foundation for the next generation of Physical AI
Autonomous mobile robots navigate warehouses, collaborative robots work alongside humans, and intelligent ...
New Mouser eBook explores AI-enabled embedded design
Mouser has announced a new eBook in collaboration with Arduino – From Blink to Think: How Arduino ...
Murata expands Product Information Management API Service to cover all 73 product categories
Murata now covers all 73 product categories in its Product Information Management (PIM) API Service. ...
Infineon begins mass production of 8Tx8Rx imaging radar MMIC
Infineon Technologies has begun mass production of the RASIC CTRX8188F, an 8Tx8Rx radar transceiver ...
Infineon CoolGaN technology selected for BRC Solar’s Power Optimiser
BRC Solar has selected Infineon’s CoolGaN Transistor 100 V devices for use in its latest Power ...
EBV Elektronik launches new platform to bring transparency to electronics supply chains
EBV Elektronik has announced its new Essential Business Visibility platform (EBV360), a new supply ...
Arrow works with ST to accelerate industrial AMR development with a new reference platform
Arrow Electronics, together with its engineering services subsidiary eInfochips, has worked with ST ...
SYSGO supports Airbus defence and space SAETA II programme
SYSGO has announced its intention to support the Airbus Defence and Space-led SAETA II programme, ...
Smart city network uses edge computing from Intel to bridge digital divide
A new municipal broadband initiative in Bellflower, California, is demonstrating how edge computing ...
Rutronik concludes new franchise agreement with 3PEAK throughout EMEA
Rutronik has signed a new franchise agreement with semiconductor manufacturer 3PEAK Incorporated. ...
Farnell launches drone solutions proposition to support growing demand across EMEA
Farnell has announced the launch of its dedicated drone solutions proposition, designed to support ...
Mouser’s “Rise of the Robots” episode explores humanoid design considerations
Mouser has announced the latest instalment of its Empowering Innovation Together (EIT) technology ...
u-blox GNSS technology powers next-gen telescope array in search for extraterrestrial intelligence
u-blox has announced that its ZED-F9T high-precision GNSS receiver is enabling sub-nanosecond synchronisation ...
Anglia and Nanopower reduce IoT power and increase battery life for UK and EU customers
Anglia Components has signed a pan-European distribution agreement with Nanopower Semiconductor, the ...
Emendion selects Insight SIP’s for their Bluetooth Low Energy and Auracast miniature microphone
Bluetooth Low Energy (LE) Audio has been available for several years now, based on the Bluetooth 5.2 ...
ROHM at PCIM Europe 2026: Advancing SiC power technology for e-mobility and industry
ROHM will exhibit at PCIM Expo & Conference 2026, the leading international event for power electronics, ...
Experience Panasonic Industry’s innovations at smarter E Europe
Under the slogan “Switch Your Smart,” Panasonic Industry Europe will be showcasing relay solutions ...
Solid Sands to address toolchain trust for physical AI at Robotics Summit
Solid Sands will participate in the Robotics Summit & Expo 2026 (27–28 May, Boston, USA). Solid ...
Mouser and EPC enter global distribution agreement to deliver high-performance power solutions
Mouser has announced a global distribution agreement with Efficient Power Conversion (EPC) offering ...
Join HARTING for their “Modular Industrial Connectors” webinar series
In this webinar series, HARTING will provide an overview of our modular industrial connectors and ...
NXP collaborates with Quanta to accelerate networking for software defined vehicles
As the automotive industry transitions to software defined vehicle (SDV) architectures, NXP Semiconductors ...
TI to showcase new automotive, industrial and data centre innovations at PCIM 2026
At PCIM 2026, June 9-11 in Nuremberg, Germany, Texas Instruments (TI) will exhibit how semiconductor ...
Discover Melexis’ power electronics solutions in action at PCIM 2026
Melexis will showcase its latest sensing and protection technologies for ePowertrain and power electronics ...
Infineon Startup Challenge 2026 puts humanoid robotics in the spotlight
Infineon’s Startup Challenge brings together promising founder teams and young high-tech ...
Discover Murata’s latest power innovations at PCIM 2026
Murata will showcase its latest innovations in power electronics at this year’s PCIM exhibition, ...
Anglia adds UK-manufactured opto isolators from Isocom Components
Anglia Components has signed a Pan-European distribution agreement with Isocom Components the leading ...
ByteSnap launches fast-track service to help manufacturers beat cellular shutdown deadlines
ByteSnap Design, an embedded software and electronic product development consultancy, has announced ...
Melexis and OYMotion elevate tactile sensing for next-generation robotic hands
Melexis is accelerating its robotics roadmap as Tactaxis, a breakthrough magnetic tactile sensor, ...
Omron publishes product carbon footprint data ahead of new sustainability rules
Omron is scaling product carbon footprint (PCF) reporting across its portfolio, including popular ...
Infineon’s rad-hard semiconductor solutions used on Artemis II
NASA’s Artemis II mission has successfully returned to Earth after ten days in space, having ...
Microchip collaboration delivers camera modules for the automotive market
Microchip and Sunny Smartlead (subsidiary of Sunny Optical Technology Group), a global automotive ...
Mouser explores how AI shapes everyday technologies and experiences
Mouser has announced the first 2026 instalment of its Empowering Innovation Together (EIT) technology ...
Renesas’ rad‑hard ICs take flight on NASA’s Artemis II crewed lunar mission
Renesas has announced its radiation‑hardened (rad-hard) ICs are being used in NASA’s Artemis II ...
DigiKey launches video series exploring the future of electronic design
DigiKey has announced the launch of its new video series, Engineering Unlocked. The three-episode ...
element14 Community launches smart industry design challenge
element14 has launched its latest design competition, inviting engineers, makers and technology enthusiasts ...
DigiKey collaborates with ST and Ultra Librarian to deliver enhanced eDesignSuite integration
DigiKey has announced the availability of an enhanced eDesignSuite experience, developed through a ...
Mouser sponsors 2026 Global “Create the Future” design contest
Mouser has announced that it is once again a Platinum sponsor of the Create the Future Design Contest. ...
Infineon accelerates deployment of safe and secure robots using digital twins in collaboration with NVIDIA
Infineon has announced the expansion of its collaboration with NVIDIA to advance system architectures ...
ST and Leopard accelerate robotics vision with NVIDIA multi-sensor module
ST and Leopard Imaging have introduced an all-in-one multimodal vision module for humanoid and other ...
Mythic selects memBrain Technology from SST for ultra-low-power analog processing units
Mythic has chosen memBrain neuromorphic hardware intellectual property (IP) from Microchip Technology’s ...
Aetina launches AIP-FR68S edge AI workstation at Embedded World 2026
As the flagship addition to the MegaEdge series, the AIP-FR68S demonstrates heterogeneous computing ...
TI accelerates the next generation of physical AI with NVIDIA
TI today announced it is accelerating the safe deployment of humanoid robots into the real world with ...
Mouser’s autonomous vehicle resource centre addresses real-world deployment challenges
Mouser has expanded its Autonomous Vehicle (AV) resource centre focused on the system architectures ...
ROHM strengthens supply capability for GaN power devices
ROHM has decided to integrate its own development and manufacturing technologies for GaN power devices ...
Infineon presents solutions for the future of AI, IoT, mobility, and robotics at EW 2026
At embedded world 2026, taking place from 10 to 12 March 2026 in Nuremberg, Germany, Infineon will ...
R&S and Broadcom showcase first Wi-Fi 8 RF signalling tests, paving way for next-gen connectivity
Rohde & Schwarz, in collaboration with Broadcom, will display its CMX500 multi-technology multi-channel ...
Murata expands ZENCROSS Alliance IoT ecosystem with new engineering and development partners
Murata expands the ZENCROSS Alliance ecosystem with the addition of qualified engineering and development ...
ams Osram to standardise the Open System Protocol for automotive applications
OSP, the Open System Protocol developed by ams OSRAM for dynamic lighting and intelligent vehicle ...
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