Ceva brings IP, proteanTec brings data analytics for SoC design excellence
Wireless connectivity IP specialist, Ceva has partnered with data analytics company, proteanTecs to serve joint customers in the automotive and wireless communication markets to optimise SoC design.
The two companies already serve mutual customers in mission-critical applications. For example, Autotalks has deployed CEVA vector and scalar DSP IP solutions with proteanTecs’ predictive system monitoring solutions into chipsets for vehicle to everything (V2X) communications.
Amos Freund, vice president of R & D at Autotalks, said: “With CEVA’s DSPs and proteanTecs in-depth data, we are able to concurrently support DSRC and C-V2X technologies with the needed visibility to assure rigorous reliability with predictive monitoring for our customers.”
proteanTecs’ technology is able to monitor and extend the lifespan, power profile and performance of CEVA-powered chips, said Michael Boukaya, Ceva’s COO. “We see tremendous value in collaborating to support our joint customers, especially in mission- and uptime-critical applications.”
proteanTecs will be able to work with Ceva for the development of custom SoCs that target the aerospace and defence sectors, where Ceva has demonstrable experience.
proteanTecs provides deep data analytics for advanced electronics monitoring to companies in the data centre, automotive, communications and mobile markets. The company provides system health and performance monitoring, from production to the field. By applying machine learning to novel data created by on-chip monitors, the company’s deep data analytics deliver visibility and actionable insights, said the company. Founded in 2017, the company is headquartered in Israel and has offices in the United States, India and Taiwan.
Ceva licenses wireless connectivity and smart sensing technologies and custom SoCs, providing digital signal processors, AI engines, wireless platforms, cryptography cores and complementary embedded software for sensor fusion, image enhancement, computer vision, spatial audio, voice input and artificial intelligence.