Ceva releases Bluetooth 5.3 IP for audio streaming
Supporting features to further enhance security, robustness and low power operation, the RivieraWaves Bluetooth 5.3 IP is now available from Ceva as a complete hardware/software solution for new designs. It is also available as a software-only upgrade for compatible existing designs.
The Bluetooth standard continues to evolve to meet evolving battery life and performance challenges. Bluetooth 5.3 introduces new features including enhanced periodic advertising and low energy (LE) connection subrating, all designed to improve protocol efficiency in terms of power and latency. Link robustness is also enhanced with the LE channel classification signalling, as is wireless security with improvements in the human computer interaction (HCI) encryption key size control. The enhancements in the standard by the Bluetooth SIG, coupled with the low power architecture of the RivieraWaves Bluetooth IP platform gives chip designers an advantage in the competitive wireless consumer market, says Ceva.
Ceva’s RivieraWaves Bluetooth IP platforms consist of a hardware baseband controller, with a feature-rich and comprehensive software protocol stack. A flexible radio interface allows the platforms to be deployed with either RivieraWaves RF or partners’ RF IP, enabling optimal selection of foundry and process node. All the latest features of Bluetooth are supported, including isochronous channels for LE audio, direction finding (AoA/AoD), randomised advertising channel indexing, periodic advertising sync transfer, GATT caching and other enhancements. RivieraWaves Bluetooth IP is widely deployed in consumer and IoT devices with many of the world’s leading semiconductors companies and OEMs, including smartphones, tablets, wireless speakers, wireless headsets and earbuds, hearing aids and other wearables.
Ceva licenses wireless connectivity and smart sensing technologies. It provides digital signal processors (DSPs), artificial intelligence (AI) engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and AI. These technologies are offered in combination with Intrinsix turnkey chip design services, helping customers address complex and time-critical IC design projects. Technologies and chip design are used to create power-efficient, intelligent, secure and connected devices for mobile, consumer, automotive, robotics, industrial, aerospace and defence and IoT.
DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio / voice / speech and low power always-on / sensing applications for multiple IoT markets. Hillcrest Labs sensor processing technologies provide a sensor fusion software and inertial measurement units (IMUs) for markets including hearables, wearables, AR / VR, PC, robotics, remote controls and IoT. For wireless IoT, our platforms for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB) and NB-IoT are the most broadly licensed connectivity platforms in the industry.
Picture credit: D Kosig
