Cloud OpenLink delivers seamless interoperability says Synopsys

A multi-vendor environment of EDA, IP and foundry solutions is collectively available on the Synopsys Cloud OpenLink programme.
According to Synopsys, it delivers seamless interoperability for semiconductor d and can accelerate chip development.
The programme is believed to be the first of its kind to enable chip designers to seamlessly access third party electronic design automation (EDA) tools and IP in the Synopsys Cloud environment.
As part of this initiative, Synopsys is releasing an application programming interface (API) specification that Synopsys Cloud OpenLink program members can use to deploy system level integration with a highly secure and reliable transfer of entitlements to Synopsys Cloud. This offers mutuals customers an end-to-end SoC design environment with efficient access to EDA solutions, IP, and compute of their choice.
The Synopsys Cloud OpenLink programme helps eliminate the need for design teams to engage in time-consuming and labour-intensive handling of licensing and deployment details across EDA, IP, and foundry vendors, by providing quick and easy access to these elements. The Synopsys Cloud OpenLink API helps ensure a secure handshake between Synopsys Cloud and member systems for accurate and protected customer entitlement and access, said Synopsys.
“Customers are successfully deploying complex design flows with EDA tools and IP of their choice on Synopsys Cloud across designs spanning AI, automotive, mobile, and data center applications,” said Shankar Krishnamoorthy, general manager of the Synopsys EDA group. “The Synopsys Cloud OpenLink program is a natural extension of this solution to further enable robust design flows with industry-wide interoperability. This first of its kind programme including an open API enables more designers to benefit from our SaaS [software as a service] offering, bringing the design ecosystem together to accelerate chip development through a seamless cloud environment.”
Partners include Ansys which has collaborated with Synopsys to deliver integrated flows in the areas of timing, voltage drop, and thermal analysis.
Another partner is GlobalFoundries. “With the Synopsys Cloud OpenLink programme, AI chip design startups such as Mentium Technologies are able to deploy GlobalFoundries process design kits (PDKs) on the Synopsys Cloud SaaS platform seamlessly for an end-to-end browser-based experience,” said Ziv Hammer, senior vice president of Customer Design Enablement at GlobalFoundries.
“Our mutual customers are already using Keysight RFPro electromagnetic simulation as part of a complete analogue / RF chip design flow on Synopsys Cloud,” added  Niels Faché, GM / VP for Keysight EDA.  The Synopsys Cloud OpenLink program will further enable additional Keysight tools to be used on Synopsys Cloud, such as its Advanced Design System, making the programme an enabler of industry-wide interoperability for cloud-based EDA, he added.
Mujtaba Hamid, GM, Secure Cloud Environments at Microsoft. “The Synopsys Cloud OpenLink programme makes interoperability across diverse chip design flows seamless and efficient for our mutual customers.”
The Synopsys Cloud OpenLink program is available now for chip design ecosystem vendors to join.

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