COMeT10-3900 is first in industrial COM series says Winsystems
Marking the company’s entrance into the industrial computer on module (COM) market, Winsystems has released the COMeT10-3900 COM Express Type 10 mini module based on the Intel E3900 series SoC processor.
This debut product leverages the company’s 38 years’ of proven expertise in designing and manufacturing highly reliable embedded computing solutions, points out Winsystems. It is a logical extension of its industrial single board computer (SBC) systems, it says and largely driven by customer demand.
Leveraging the Intel Atom E3900 series SoC processor, the COMeT10-3900’s performance is designed for embedded computing in such applications as unmanned vehicles, digital surveillance, transportation, Mil/COTS, industrial automation and medical diagnostics. It offers up to 8Gbytes LPDDR4 2400MTransfers per second for fast system memory. Hardware security is provided via the module’s onboard discrete TPM 2.0 device for root of trust authentication.
The COMeT10-3900 module is designed specifically for rugged and industrial IoT environments. It delivers durability and reliability in operating temperatures ranging from -40 to +85 degrees C. It also offers a wide-range power input, accommodating 4.75V to 20V DC and onboard eMMC 5.x storage options that extend from 8Gbyte to 128Gbyte. The module also has soldered LPDDR4 for shock- and vibration-sensitive applications.
The US designed and manufactured COM Express Type 10 mini module includes two display interfaces: one digital display interface that can be converted to DisplayPort, HDMI or DVI on the carrier, and one embedded DisplayPort (eDP) LCD interface that can be optionally populated with a single-channel LVDS output.
The COMeT10-3900 also supports build options for high-speed UARTs or legacy UARTs compatible with PC-style interfaces. There is also TPM 2.0 with options for either legacy interfaces, or legacy-free eDP and HSUARTs.
The COMeT10-3900 COM Express module offers connectivity through four PCIe lanes configurable as 4×1, 2×1 + 1×2, or 1×4, two USB 3.1 Gen 1 and six USB 2.0 channels and one i210 1Gbit per second Ethernet RGMII with IEEE 1588 support. HD audio signals and two SATA 3.0 channels are also available.
The COMeT10-3900 modules will become available during Q4 2020 and will ship from Winsystems’ headquarters in Texas, USA, with product manual and a carrier design guide. A Mini-ITX evaluation carrier and thermal solutions will be sold separately.